IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第77页

External Annular Ring: The minimum annular ring on external layers is the minimum amount of copper (at the narrowest point) between the edge of the hole and the edge of the land after plating of the finished hole (see Fi…

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Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• Conductor spacing meets dimensional requirements of the pro-
curement documentation.
• 导体间距满足采购文件的尺寸要求。
Acceptable - Class 3（可接受条件 - 3级）
• Any combination of edge roughness, copper spikes, etc., that does
not reduce the specified minimum conductor spacing by more
than 20% in isolated areas.
• 任何孤立区域内导体边缘粗糙、铜刺等缺陷的任意组合未使
规定的最小导体间距的减少大于20%。
Acceptable - Class 1,2（可接受条件 - 1,2级）
• Any combination of edge roughness, copper spikes, etc., that does
not reduce the specified minimum conductor spacing by more
than 30% in isolated areas.
• 任何孤立区域内导体边缘粗糙、铜刺等缺陷的任意组合未使
规定的最小导体间距的减少大于30%。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图21012a
图21012b
图21012c
图21012d
2.10 PATTERN DEFINITION – DIMENSIONAL（图形精确度 – 尺⼨要求）
2.10.1.2 Conductor Spacing（导体间距）
68 IPC-A-600H-20102010年4月
External Annular Ring: The minimum annular ring on external layers is the minimum amount of copper (at the narrowest point) between
the edge of the hole and the edge of the land after plating of the finished hole (see Figure 2102a). Hole breakout refers to a condition where
a hole is not completely surrounded by the land (see Figure 2102b).
外层环宽：外层的最小环宽是成品孔在电镀后孔边缘和焊盘边缘之间（最窄处）的最小量的铜（见图2102a）。孔的破环指孔未被
焊盘完全包围的状况（见图2101b）。
Conductor to Land Junction: A 90° area centered around the point where the conductor connects to the land (see Figure 2102c). This
area only applies to breakout conditions (see Figure 2102d).
导体与焊盘的连接区：以导体与焊盘连接点为中心的90°区域（见图2102c）。该区域仅适用于破环的状况（见2102d）。
图2102a 外层环宽
图2102b 90°和180°的破环
B
A
180°
90°
图2102c 导体与焊盘的连接区 图2102d 导体与焊盘连接处的破环
2.10 PATTERN DEFINITION – DIMENSIONAL（图形精确度 – 尺⼨要求）
2.10.2 External Annular Ring – Measurement（外层环宽的测量）
69IPC-A-600H-2010 2010年4月
Supported Hole: A hole within a printed board that has its inside surfaces plated or otherwise reinforced.
⽀撑孔：印制板中孔的表面经过电镀或采用其它方法增强的孔。
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• Holes are centered in the lands.
• 孔位于焊盘中心。
Acceptable - Class 3（可接受条件 - 3级）
• Holes are not centered in the lands, but the annular ring measures
0.050 mm [0.0020 in] or more.
• The minimum external annular ring may have 20% reduction of
the minimum annular at the measurement area due to defects such
as pits, dents, nicks, pinholes, or splay.
• 孔 没有位 于 焊 盘中心，但 环宽大于或等于0.050mm[0.0020
in]。
• 测量区域内的最小环宽由于诸如麻点、凹坑、缺口、针孔或
斜孔等缺陷的存在，可减少最小外层环宽的20%。
图2103a
图2103b
0.050 mm
[0.0020 in]
0.050 mm
[0.0020 in]
0.050 mm
[0.0020 in]
图2103c
0.050 mm
[0.0020 in]
2.10 PATTERN DEFINITION – DIMENSIONAL（图形精确度 – 尺⼨要求）
2.10.3 External Annular Ring – Supported Holes（⽀撑孔的外层环宽）
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