IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第155页

Smear removal is the removal of debris that results from the formation of the hole. Smear removal should be sufficient to completely remove resin from the surface of conductor interface. 去钻 污 是除 去 在 孔 形 成 时产生的 碎屑 。 去钻 污 …

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Target Condition/Acceptable - Class 1,2,3（⽬标条件/可接受条件 - 1,2,3级）
• Etchback between 0.003 and 0.08 mm [0.00012 and 0.0031 in].
• Shadowing permitted on one side of each land.
• 凹蚀深度在0.003mm[0.00012in]和0.08mm[0.0031in]之间。
• 允许每个焊盘的一侧出现凹蚀阴影。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
Caution: Etchback greater than 0.05 mm [0.0020 in] may cause folds or voids in the plating, which then may not meet the required copper
thickness.
注意：大于0.05mm[0.0020in]的凹蚀可能会在镀层中造成折叠或空洞，因此可能不能满足要求的铜厚。
图419a
Note: Due to various materials used in the construction of rigid-flex printed boards, varying degrees of preferential etchback are exhibited among
the various materials.
注：由于刚挠印制板结构使用的材料不同，各种材料的首选凹蚀程度也各不相同。
4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
4.1.9 Etchback (Type 3 and Type 4 Only)（凹蚀（仅3型和4型板））
146 IPC-A-600H-20102010年4月
Smear removal is the removal of debris that results from the formation of the hole. Smear removal should be sufficient to completely remove
resin from the surface of conductor interface.
去钻污是除去在孔形成时产生的碎屑。去钻污应该足以完全除去导体界面表面的树脂。
Target Condition/Acceptable - Class 1,2,3（⽬标条件/可接受条件 - 1,2,3级）
• Smear removal process not etched back more than 0.025 mm [0.001 in].
• Random tears or gouges that produce small areas where the 0.025 mm [0.001 in] depth is exceeded, provided dielectric spacing is main-
tained.
• 去钻污过程没有使凹蚀超过0.025mm[0.001in]。
• 在满足介质间距的情况下，小区域产生的深度超过0.025mm[0.001in]的随机撕裂或凿槽是可接受的。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图4110a
Note: Smear removal is not required of Type 1 or Type 2 flexible printed boards.
注：对于1型和2型挠性印制板，不要求去钻污。
4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
4.1.10 Smear Removal (Type 3 and 4 Only)（去钻污（仅3型和4型板））
147IPC-A-600H-2010 2010年4月
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• Free of nicks and tears. Minimum edge to conductor spacing
maintained.
• The trimmed edge of the flexible printed board or the flexible
section of the finished rigid-flex printed board is free of burrs,
nicks, delamination, and tears.
• 无缺口和撕裂。满足板边到导体的最小间距。
• 挠性印制板或已完 工的刚挠印制板挠性段的裁切边缘无毛
刺、无缺口、无分层且无撕口。
Acceptable - Class 1,2,3（可接受条件 - 1,2,3级）
• No nicks, burrs or delamination in excess of that specified in the
procurement documentation.
• No tears in Type 1 or Type 2 flexible printed boards.
• No tears in the flexible portion of Type 3 or Type 4 flexible
printed boards.
• Nicks and tears that occur as a result of tie-in tabs to facilitate cir-
cuit removal as AABUS.
• Edge to conductor spacing of the flexible portion is within
requirements specified on the procurement documentation.
• Nicks or haloing along the printed board edges, cutouts, and
unsupported holes of the rigid portion of a rigid/flex printed
board, providing the penetration does not exceed 50% of the dis-
tance from the edge to the nearest conductor or more than 2.5 mm
[0.0984in], whichever is less.
• 缺口、毛刺或分层没有超过采购文件规定。
•1型和2型挠性印制板中无撕口。
•3型和4型挠性印制板的挠性段无撕口。
• 由于便于拆除电路连接头产生的缺口和撕口由供需双方协商
确定。
• 挠性段板边到导体的间距在采购文件规定的要求范围内。
• 沿印制板板边、切割和刚挠性印制板刚性段上非支撑孔允许
有缺口或晕圈，只要不超过板边到最近导体的距离的50%，
或不超过2.5mm[0.0984in]，取两者中的较小值。
Acceptable - AABUS（可接受条件 - 由供需双⽅协商确定）
• When nicks and tears occur as a result of tie-in tabs to facilitate
circuit removal, the extent of these imperfections does not exceed
the requirements agreed to by user and supplier.
• 当缺口和撕口是由于为便于拆除电路由连接头而产生时，这
些瑕疵的程度未超过由供需双方协商确定的要求。
图4111a
图4111b
图4111c
图4111d
4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
4.1.11 Trimmed Edges/Edge Delamination（裁切边缘/边缘分层）
148 IPC-A-600H-20102010年4月