IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第70页
T arget Condition - Class 1,2,3 （⽬标条件 - 1,2,3级） • There are no wrinkles, waves, ripples or other defects in the sol- der mask coating over the printed board base material surfaces or conductive patterns. • 印制板基材表面 或 导电 图…
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• The surface of the solder mask is uniform in appearance and is
firmly bonded to the printed board surfaces.
• 阻焊膜表面外观均匀并牢固地粘附在印制板表面。
Acceptable - Class 2,3（可接受条件 - 2,3级）
• No evidence of solder mask lifting from the printed board prior to
testing.
• After testing in accordance with IPC-TM-650, Method 2.4.28.1,
the amount of solder mask lifting does not exceed the allowable
limits of the IPC-6010 Series.
• 测试前没有阻焊膜从板面上起翘的迹象。
• 按照IPC-TM-650测试方法2.4.28.1测试后，阻焊膜的脱落量
未超过IPC-6010系列标准规定的允许限值。
Acceptable - Class 1（可接受条件 - 1级）
• Prior to testing, the solder mask is flaking from the printed board
base material or conductive pattern surfaces and the remaining
solder mask is firmly bonded. The missing solder mask does not
expose adjacent conductive patterns or exceed allowable lifting.
• After testing in accordance with IPC-TM-650, Method 2.4.28.1,
the amount of solder mask lifting does not exceed the allowable
limits of the IPC-6010 Series.
• 测试前有阻焊膜从印制板基材或导电图形表面剥落，但其余
阻焊膜牢固地粘附在板面上。缺失的阻焊膜未暴露相邻导电
图形或未超过脱落的允许值。
• 按照IPC-TM-650测试方法2.4.28.1测试后，阻焊膜落脱的量
未超过IPC-6010系列标准的允许限值。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图295a
图295b
图295c
2.9 SOLDER MASK（阻焊膜（阻焊剂））
2.9.5 Adhesion (Flaking or Peeling)（附着⼒（剥落或起⽪））
61IPC-A-600H-2010 2010年4月
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• There are no wrinkles, waves, ripples or other defects in the sol-
der mask coating over the printed board base material surfaces or
conductive patterns.
• 印制板基材表面或导电图形上的阻焊膜涂覆层均未出现皱
褶、波纹、皱纹或其它缺陷。
Acceptable - Class 1,2,3（可接受条件 - 1,2,3级）
• Waves or ripples in the solder mask do not reduce the solder mask
coating thickness below the minimum thickness requirements
(when specified).
• Wrinkling is located in an area that does not bridge conductive
patterns and passes IPC-TM-640, Method 2.4.28.1 (adhesion tape
pull test).
• 阻焊膜中的波纹或皱纹没有使阻焊剂涂覆层厚度减小至低于
最小厚度要求（当有规定时）。
• 在一个区域内出现的皱褶没有使导电图形桥连，并通过IPC-
TM-650测试方法2.4.28.1的胶带附着力测试。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图296a
图296b
图296c
2.9 SOLDER MASK（阻焊膜（阻焊剂））
2.9.6 Waves/Wrinkles/Ripples（波纹/褶皱/皱纹）
62 IPC-A-600H-20102010年4月
Tenting refers to a via with a mask material applied bridging over the via wherein no additional materials are in the hole. It may be applied
to one side or both sides of the via structure (see Figure 297a), though single sided tenting is not recommended.
用掩膜材料涂敷在孔上，而孔内无其它额外材料的导通孔。可从导通孔的任一面或两面涂敷材料（见图297c），但不推荐从单面
掩蔽导通孔。
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• All holes required to be tented are completely covered with mask.
• 所有要求掩蔽的孔都被掩膜完全覆盖。
Acceptable - Class 1,2,3（可接受条件 - 1,2,3级）
• All holes required to be tented are covered by mask.
• 所有要求掩蔽的孔都被掩膜覆盖。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图297b
图297c
图297a
注：此图仅⽤作说明状况，并不要求做显微剖切评价。
2.9 SOLDER MASK（阻焊膜（阻焊剂））
2.9.7 Tenting (Via Holes)（掩蔽（导通孔））
63IPC-A-600H-2010 2010年4月