IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第86页
Nonconforming - Class 1,2,3 （不符合条件 - 1,2,3级） • Defects either do not meet or exceed above criteria. • 缺陷不符合或 超 出上述要求。 3.1.2 Registration/Conductor to Holes （导体与孔的重合度） Registration of conductors is typically determined wi…
Acceptable - Class 2,3（可接受条件 - 2,3级）
• Void/crack less than or equal to 0.08 mm [0.0031 in] and does not
violate minimum dielectric spacing.
• Laminate anomalies or imperfections, such as voids/cracks or
resin recession, in Zone A areas that have been exposed to ther-
mal stress and rework simulation.
• Multiple voids/cracks between two adjacent plated-through holes
in the same plane that do not have combined length which
exceeds these limits.
• 空洞/裂缝小于或等于0.08mm[0.0031in]且不违反最小介质间
距要求。
• 经热应力及模拟返工测试后，允许A区出现诸如空洞/裂缝
或树脂凹缩等层压板异常或瑕疵。
• 当同一层面上相邻的两镀覆孔间出现多个空洞/裂缝时，其
累加长度未超出上述限制。
Acceptable - Class 1（可接受条件 - 1级）
• Void/crack less than or equal to 0.15 mm [0.00591 in] and does
not violate minimum dielectric spacing.
• Laminate anomalies or imperfections, such as voids/cracks or
resin recession, in Zone A areas that have been exposed to ther-
mal stress and rework simulation.
• Multiple voids/cracks between two adjacent plated-through holes
in the same plane that do not have combined length which
exceeds these limits.
• 空洞/裂缝小于或等于0.15mm[0.00591in]且不违反最小介质
间距要求。
• 经热应力及模拟返工测试后，允许A区出现诸如空洞/裂缝
或树脂凹缩等层压板异常或瑕疵。
• 当同一层面上相邻的两个镀覆孔间出现多个空洞裂缝时，其
累加长度未超出上述限制。
图311c
3.1 DIELECTRIC MATERIALS（介质材料）
3.1.1 Laminate Voids/Cracks (Outside Thermal Zone) (cont.)（层压板空洞/裂缝（受热区外）（续））
77IPC-A-600H-2010 2010年4月
Visual observations made on cross-sections only.（仅对显微切片进行目检观察。）
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
3.1.2 Registration/Conductor to Holes（导体与孔的重合度）
Registration of conductors is typically determined with respect to PTH lands. Requirements are established through minimum internal annu-
lar ring (see 3.3.1).
导体与孔的重合度通常是相对于镀覆孔焊盘来测定的。其要求是通过最小内层环宽来确定的（见3.3.1节）。
图311d
图311e
3.1 DIELECTRIC MATERIALS（介质材料）
3.1.1 Laminate Voids/Cracks (Outside Thermal Zone) (cont.)（层压板空洞/裂缝（受热区外）（续））
78 IPC-A-600H-20102010年4月
Visual observations made on cross-sections only.（仅对显微切片进行目检观察。）
Target Condition - Class 1,2,3（⽬标条件 - 1,2,3级）
• Power/Ground plane setback meets the procurement documenta-
tion requirements.
• 电源层/接地层到隔离孔的余隙符合采购文件的要求。
Acceptable - Class 1,2,3（可接受条件 - 1,2,3级）
• A) Power/ground plane setback is greater than the minimum elec-
trical conductor spacing specified on the procurement documen-
tation.
• B) Ground plane may extend to the edge of an unsupported hole
when specified in the procurement documentation.
•A）电源层/接地层到隔离孔的余隙大于采购文件规定的最
小导体间距。
•B）当采购文件有规定时，接地层可以延伸到非支撑孔的边
缘。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图313a
图313b
A
B
图313c
3.1 DIELECTRIC MATERIALS（介质材料）
3.1.3 Clearance Hole, Unsupported, to Power/Ground Planes（电源层/接地层上的⾮⽀撑孔，隔离孔）
79IPC-A-600H-2010 2010年4月
Visual observations made on cross-sections only.（仅对显微切片进行目检观察。）