IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第154页
T arget Condition/Acceptable - Class 1,2,3 （⽬标条件/可接受条件 - 1,2,3级） • Etchback between 0.003 and 0.08 mm [0.00012 and 0.0031 in]. • Shadowing permitted on one side of each land. • 凹 蚀深 度 在 0.003mm[0.00012in] 和 0.08mm[0.0031…
Target Condition（⽬标条件）
• No laminate or adhesive voids or cracks.
• 无层压板或粘接剂空洞或裂缝。
Acceptable - Class 2,3（可接受条件 - 2,3级）
• Laminate voids or cracks are not evaluated in Zone A.
• Laminate voids or cracks that originate in Zone A and extend into
Zone B or are entirely in Zone B, in the rigid portion of the printed
board, are not in excess of 0.08 mm [0.0031 in] in Zone B.
• Adhesive voids or cracks that originate in Zone A and extend into
Zone B or are entirely in Zone B, in the flexible portion of the
printed board, are not in excess of 0.5 mm [0.020 in] in Zone B.
•A区中层压板空洞或裂缝不作评定。
• 在印制板刚性部分，从A区延伸到B区或完全在B区中的层压
板空洞或裂缝不超过0.08mm[0.0031in]。
• 在印制板挠性部分，从A区延伸到B区或完全在B区中的粘接
剂空洞或裂缝不超过0.5mm[0.020in]。
Acceptable - Class 1（可接受条件 - 1级）
• Laminate voids or cracks are not evaluated in Zone A.
• Laminate voids or cracks that originate in Zone A and extend into
Zone B or are entirely in Zone B, in the rigid portion of the printed
board, are not in excess of 0.15 mm [0.00591 in] in Zone B.
• Adhesive voids or cracks that originate in Zone A and extend into
Zone B or are entirely in Zone B, in the flexible portion of the
printed board, are not in excess of 0.5 mm [0.020 in] in Zone B.
•A区中层压空洞或裂缝不作评定。
• 在印制板刚性部分，从A区延伸到B区或完全在B区中的层压
空洞或裂缝不超过0.15mm[0.00591in]。
• 在印制板挠性部分，从A区延伸到B区或完全在B区中的粘接
剂空洞或裂缝不超过0.5mm[0.020in]。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图4182a
Notes:
1. The thermal zone extends 0.08 mm [0.0031 in] beyond the end of the land that is most radially extended.
2. Multiple voids or cracks between PTHs in the flex area and in the same plane shall not have combined length exceeding the limits for all classes
注：
1. 受热区是指从内层或外层中最靠外的焊盘边缘径向延伸0.08mm[0.0031in]所包含的区域。
2. 对于所有级别产品，在挠性区域内同一层面上镀覆孔间的多个空洞或裂缝，其累积长度不应当超出规定的限值。
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4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
4.1.8.2 Laminate Integrity – Rigid-Flex Printed Board（层压板的完整性 – 刚挠性印制板）
145IPC-A-600H-2010 2010年4月
Target Condition/Acceptable - Class 1,2,3（⽬标条件/可接受条件 - 1,2,3级）
• Etchback between 0.003 and 0.08 mm [0.00012 and 0.0031 in].
• Shadowing permitted on one side of each land.
• 凹蚀深度在0.003mm[0.00012in]和0.08mm[0.0031in]之间。
• 允许每个焊盘的一侧出现凹蚀阴影。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
Caution: Etchback greater than 0.05 mm [0.0020 in] may cause folds or voids in the plating, which then may not meet the required copper
thickness.
注意：大于0.05mm[0.0020in]的凹蚀可能会在镀层中造成折叠或空洞，因此可能不能满足要求的铜厚。
图419a
Note: Due to various materials used in the construction of rigid-flex printed boards, varying degrees of preferential etchback are exhibited among
the various materials.
注：由于刚挠印制板结构使用的材料不同，各种材料的首选凹蚀程度也各不相同。
4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
4.1.9 Etchback (Type 3 and Type 4 Only)（凹蚀（仅3型和4型板））
146 IPC-A-600H-20102010年4月
Smear removal is the removal of debris that results from the formation of the hole. Smear removal should be sufficient to completely remove
resin from the surface of conductor interface.
去钻污是除去在孔形成时产生的碎屑。去钻污应该足以完全除去导体界面表面的树脂。
Target Condition/Acceptable - Class 1,2,3（⽬标条件/可接受条件 - 1,2,3级）
• Smear removal process not etched back more than 0.025 mm [0.001 in].
• Random tears or gouges that produce small areas where the 0.025 mm [0.001 in] depth is exceeded, provided dielectric spacing is main-
tained.
• 去钻污过程没有使凹蚀超过0.025mm[0.001in]。
• 在满足介质间距的情况下，小区域产生的深度超过0.025mm[0.001in]的随机撕裂或凿槽是可接受的。
Nonconforming - Class 1,2,3（不符合条件 - 1,2,3级）
• Defects either do not meet or exceed above criteria.
• 缺陷不符合或超出上述要求。
图4110a
Note: Smear removal is not required of Type 1 or Type 2 flexible printed boards.
注：对于1型和2型挠性印制板，不要求去钻污。
4.1 FLEXIBLE AND RIGID-FLEX PRINTED BOARDS（挠性及刚挠性印制板）
4.1.10 Smear Removal (Type 3 and 4 Only)（去钻污（仅3型和4型板））
147IPC-A-600H-2010 2010年4月