IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第106页
Minimum foil thickness (or conductor thickness) is the maximum continuous coplanar thickness that will conduct electrical current. Individual scratches are included, but the saw-toothed shaped ‘‘dendritic’’ surface for m…
Unless otherwise specified on the procurement documentation, the minimum total (copper foil plus copper plating) conductor thickness after
processing shall be in accordance with Table 3-1.
除非采购文件另有规定，加工后最小总导体厚度（铜箔加上铜镀层）应当满足表3-1的规定：
Table 3-1 External Conductor Thickness after Plating（表3-1 电镀后外层导体厚度）
Weight
1,4
Absolute Cu Min.
(IPC-4562 less
10% reduction)
(µm) [µin]
Plus minimum
plating for
Class 1 and 2
(20 µm) [787 µin]
2
Plus minimum
plating for Class 3
(25 µm) [984 µin]
2
Maximum Variable
Processing
Allowance
Reduction
3
(µm) [µin]
Minimum Surface
Conductor Thickness after
Processing (µm) [µin]
Class1&2 Class3
重量
1,4
铜绝对最⼩值
（IPC-4562
规定值减10%）
（µm）[µin]
对于1级和2
级产品，
加上最⼩镀层
（20µm）[787µin]
2
对于3级产品，
加上最⼩镀层
（25µm）[984µin]
2
加⼯中允许
减少的最⼤值
（µm）[µin]
3
加⼯后的最⼩表⾯导体厚度
（µm）[µin]
1级和2级 3级
1/8 oz. 4.60 [181] 24.60 [967] 29.60 [1,165] 1.50 [59] 23.1 [909] 28.1 [1,106]
1/4 oz. 7.70 [303] 27.70 [1,091] 32.70 [1,287] 1.50 [59] 26.2 [1,031] 31.2 [1,228]
3/8 oz. 10.80 [425] 30.80 [1,213] 35.80 [1,409] 1.50 [59] 29.3 [1,154] 34.3 [1,350]
1/2 oz. 15.40 [606] 35.40 [1,394] 40.40 [1,591] 2.00 [79] 33.4 [1,315] 38.4 [1,512]
1 oz. 30.90 [1,217] 50.90 [2,004] 55.90 [2,201] 3.00 [118] 47.9 [1,886] 52.9 [2,083]
2 oz. 61.70 [2,429] 81.70 [3,217] 86.70 [3,413] 3.00 [118] 78.7 [3,098] 83.7 [3,295]
3 oz. 92.60 [3,646] 112.60 [4,433] 117.60 [4,630] 4.00 [157] 108.6 [4,276] 113.6 [4,472]
4 oz. 123.50 [4,862] 143.50 [5,650] 148.50 [5,846] 4.00 [157] 139.5 [5,492] 144.5 [5,689]
Note 1. Starting foil weight of design requirement per procurement documentation.
Note 2. Process allowance reduction does not allow for rework processes for weights below
1
⁄
2
oz. For
1
⁄
2
oz. and above, the process allowance reduction allows
for one rework process.
Note 3. Reference: Min. Cu Plating Thickness
Class1=20µm[787µin] Class2=20µm[787µin] Class3=25µm[984µin]
Note 4. For copper foil above 4 oz., utilize the formula provided below.
注1：采购文件中起始铜箔重量的设计要求。
注2：对于重量小于1/2oz的铜箔，加工减少厚度值不允许进行返工制程。对于1/2oz或以上的铜箔，加工减少厚度值允许进行一次返工制程。
注3：参考：最小铜镀层厚度
1级=20µm[787µin] 2级=20µm[787µin] 3级=25µm[984µin]
注4：对于大于4oz的铜箔，采用以下的公式。
The minimum surface conductor thickness after processing values given in Table 3-1 are determined by the following equation:
Minimum Surface Conductor Thickness=a+b-c
Where:
a = Absolute copper foil minimum (IPC-4562 nominal less 10% reduction).
b = Minimum copper plating thickness (20 µm [787 µin] for Class 1 and Class 2; 25 µm [984 µin] for Class 3).
c = A maximum variable processing allowance reduction.
表3-1中给出的加工后最小表面导体厚度的值由下列公式确定：
表面导体最小厚度= a+b-c
此处：
a=铜箔最小厚度绝对值（比IPC-4562标称值少10%）。
b=最小铜镀层厚度（1级和2级为20µm[787µin]；3级为25µm[984µin]）。
c=加工允许减少的最大值。
3.2 CONDUCTIVE PATTERNS – GENERAL（导电图形 – 总则）
3.2.3 Surface Conductor Thickness (Foil Plus Plating)（表⾯导体厚度（铜箔加上镀层））
97IPC-A-600H-2010 2010年4月
Minimum foil thickness (or conductor thickness) is the maximum continuous coplanar thickness that will conduct electrical current.
Individual scratches are included, but the saw-toothed shaped ‘‘dendritic’’ surface for metal-clad adhesion promotion is excluded from the
minimum foil thickness determination, as shown in Figure 324a.
最小铜箔厚度（或导体厚度）是传导电流的最大的连续共面厚度。
确定最小铜箔厚度时，包括个别的划痕，但用于加强金属箔粘结强度的锯齿状“树枝形”表面除外，如图324a所示。
The minimum internal layer foil thickness after processing shall be in accordance with Table 3-2.
加工后所有级别产品的最小内层铜箔厚度应当符合表3-2的规定：
Table 3-2 Internal Layer Foil Thickness after Processing
Weight
Absolute Cu Min. (IPC-4562
less 10% reduction) (µm) [µin]
Maximum Variable Processing
Allowance Reduction
1
(µm) [µin]
Minimum Final Finish
after Processing (µm) [µin]
重量
铜绝对最⼩值（⽐IPC-4562规定
值减少10%）（µm）[µin]
加⼯允许的最⼤减少量
1
（µm）[µin]
加⼯后成品导体最⼩厚度
（µm）[µin]
1/8 oz. [5.10] 4.60 [181] 1.50 [59] 3.1 [122]
1/4 oz. [8.50] 7.70 [303] 1.50 [59] 6.2 [244]
3/8 oz. [12.00] 10.80 [425] 1.50 [59] 9.3 [366]
1/2 oz. [17.10] 15.40 [606] 4.00 [157] 11.4 [449]
1 oz. [34.30] 30.90 [1,217] 6.00 [236] 24.9 [980]
2 oz. [68.60] 61.70 [2,429] 6.00 [236] 55.7 [2,193]
3 oz. [102.90] 92.60 [3,646] 6.00 [236] 86.6 [3,409]
4 oz. [137.20] 123.50 [4,862] 6.00 [236] 117.5 [4,626]
Above 4 oz.
[137.20]
IPC-4562 value
less 10% reduction
6.00 [236]
6 µm [236 µin] below minimum thickness of calcu-
lated 10% reduction of foil thickness in IPC-4562
4oz. [137.20]
以上
比IPC-4562规定值减少10% 6.00 [236]
比根据IPC-4562规定值减少10%
计算出的最小厚度少6µm[236µin]
Note 1. Process allowance reduction does not allow for rework processes for weights below
1
⁄
2
oz. For
1
⁄
2
oz. and above, the process allowance reduction allows
for one rework process.
Note 2. Additional platings that may be required for internal layer conductors shall be separately designated as a plating thickness requirement.
注1：对于重量小于1/2oz的铜箔，加工减少厚度值不允许进行返工制程。对于1/2oz及其以上的铜箔，加工减少厚度值允许进行一次返工制程。
注2：内层导体需要额外镀层时，应当单独规定其镀层厚度。
图324a
3.2 CONDUCTIVE PATTERNS – GENERAL（导电图形 – 总则）
3.2.4 Foil Thickness – Internal Layers（内层铜箔厚度）
Visual observations made on cross-sections only.
98 IPC-A-600H-20102010年4月
This section identifies the acceptability characteristics in PTHs used in double-sided and multilayer rigid printed boards. Included in this sec-
tion are photographic and illustrative depictions of PTH characteristics for both drilled and punched holes, with separate examples where
appropriate.
The test specimen shall be a representative coupon such as described in IPC-2221, a portion of the printed board being tested, or a whole
printed board if within size limits.
Sample holes should be selected at random. Vertical microsections, both parallel and perpendicular to a printed board edge, are recom-
mended. Horizontal microsectioning techniques may be used as the referee. Precise encapsulation and metallurgical techniques shall be used
to assure highly polished sections with correct part alignment and polishing to the mean of the hole diameter. The polished surface should be
etched after initial smear evaluation and just prior to plating thickness measurements.
The evaluation of all properties and requirements shall be performed on the thermally stressed test coupon and all requirements shall be met.
The coupons shall be tested after the printed board is exposed to all coating, final finish and thermal processing.
本节确定了刚性双面及多层印制板中镀覆孔的可接受性特性。包含在本节中的照片与示意图分别图示了钻孔镀覆孔或冲孔镀覆孔
的特性。
试样应当是具有代表性的如IPC-2221中描述的附连板、待测试印制电路板的一部分，如果尺寸在范围之内，也可用整块印制板。
样品孔应该随机选取。建议采用垂直显微切片，它与板边既平行又垂直。仲裁时，可采用水平的显微剖切技术。在制作时应当采
用精密的灌封与金相研磨技术，通过正确的调准，以确保获得高度的抛光剖面，同时使剖面抛光到孔径的中间。抛光的表面在作
初始去钻污评价后、镀层厚度测量前应该进行微蚀。
对所有属性与要求的评定应当在经过热应力测试后的附连板上进行，且应当满足所有要求。应当在印制板经过涂敷、最终涂覆和
加热工艺后测试附连板。
Methods of Inspection:
• Hole Size (method optional - IPC-TM-650, Method 2.2.7)
A. Optical
B. Document drill blank plug or plug gages
C. Tapered hole gage
Note: Hole gages must be cleaned and storage oil must be removed prior to use.
• Visual hole wall quality
A. Voids, nodules, etc., - locate with unaided eye, use up to 10X magnification for verification.
B. Discolorations, stains, etc., - use unaided eye and/or solderability tests.
检验⽅法：
• 孔径测量（可选⽅法 - 可参考IPC-TM-650测试⽅法2.2.7）
A. 光学法
B. 标准的钻针规或塞规
C. 锥形孔规
注: 孔规使用前必须洁净,并将防锈油脂擦拭干净。
• ⽬检孔壁质量
A. 空洞、结瘤等缺陷 - 以裸眼定位，再用高至10倍的放大镜进行验证。
B. 变色、污点等缺陷 - 采用以裸眼目视及/或进行可焊性测试。
3.3 PLATED-THROUGH HOLES – GENERAL（镀覆孔 – 总则）
Introduction（引⾔）
99IPC-A-600H-2010 2010年4月