IPC-A-600H-2010 中文版 印制板的可接受性 (1).pdf - 第123页

Solder coating thickness, when specified, shall be evaluated prior to thermal stress. 当 焊 料 涂 覆 层 厚 度 有规定时, 应当 在 热 应 力 测试之 前做 评定。 T arget Condition - Class 1,2,3 (⽬标条件 - 1,2,3级) • Solder coating thickness is uniform and …

100%1 / 180
Nonconforming - Class 1,2,3(不符合条件 - 1,2,3级)
Defects either do not meet or exceed above criteria.
缺陷不符合或出上述要求。
3310c
3.3 PLATED-THROUGH HOLES – GENERAL(镀覆孔 则)
3.3.10 Plating Voids(镀层空洞)(续)
114 IPC-A-600H-201020104
Visual observations made on cross-sections only.对显微切片进行目检观察。
Solder coating thickness, when specified, shall be evaluated prior to thermal stress.
有规定时,应当测试之前做评定。
Target Condition - Class 1,2,3(⽬标条件 - 1,2,3级)
Solder coating thickness is uniform and covers etched land edge.
Exposed copper is not evident.
度均匀并覆盖已蚀边缘。没有明显
Acceptable - Class 1,2,3(可接受条件 - 1,2,3级)
Solder coating thickness is uniform. Vertical (conductor and land)
areas may not be covered. No exposed copper is evident.
度均匀,但面(体及)可以未被
盖。没有明显露铜
Nonconforming - Class 1,2,3(不符合条件 - 1,2,3级)
Defects either do not meet or exceed above criteria.
缺陷不符合或出上述要求。
Note: For solderability requirements, see 5.1.
注: 对于可性要求,见5.1节。
3311a
3311b
3311c
3.3 PLATED-THROUGH HOLES – GENERAL(镀覆孔 则)
3.3.11 Solder Coating Thickness (Only When Specified)(焊料涂覆层度(仅当有
115IPC-A-600H-2010 20104
Visual observations made on cross-sections only.对显微切片进行目检观察。
Target Condition - Class 1,2,3(⽬标条件 - 1,2,3级)
Thickness as specified on procurement documentation.
符合采文件的规定。
Acceptable - Class 1,2,3(可接受条件 - 1,2,3级)
Specified: The solder mask thickness meets the thickness require-
ments on the procurement documentation (cannot be visually
assessed).
有规定时:膜厚足采文件的要求(不能通过
目检评定)
Nonconforming - Class 1,2,3(不符合条件 - 1,2,3级)
Defects either do not meet or exceed above criteria.
缺陷不符合或出上述要求。
3312a
3312b
最小厚度,如已规定
3312c
3312d
3312e
3.3 PLATED-THROUGH HOLES – GENERAL(镀覆孔 则)
3.3.12 Solder Mask Thickness(阻焊膜度)
Visual observations made on cross-sections only.对显微切片进行目检观察。
116 IPC-A-600H-201020104