YSi-SP_Ope_E.pdf - 第62页

2-25 2 Operation No Name Description of displayed item and functions 5 Display selection The data and menu alternate with tab selection. When “Menu” is selected [Profile disp] The profile screen is displayed. (Refer to &…

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Operation
3.4 Measurement
Items displayed on the measurement screen and functions are described.
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When “Result” is selected
24225-KMN-00
No Name Description of displayed item and functions
1 Image of PCB
The image of the entire PCB is displayed.
The field of view is indicated with a blue frame, while the selected field of view is indicated with
a pink frame.
In addition, parts judged to be faulty and those judged to call for attention are displayed in the
corresponding colors having been defined in the PCB data.
2 Image of field of view The image of the field of view selected in the entire PCB image is displayed.
3 Pad image
Eight pads in the selected field of view are displayed.
Pad of the currently selected is displayed in the specified color settings. (Section 3.6 display-
related reference). Parts judged to be faulty and those judged to call for attention are displayed
in the corresponding colors having been defined in the PCB data.
4 Edit buttons
Use to select the field of view from image 1.
Use the button to select a pad in image 1.
Use the button to zoom in images 1 and 2.
Use the button to zoom out images 1 and 2.
The parts judged to be faulty are displayed. Faulty parts blink in red in image 2,
while only faulty parts are displayed in image 3.
The parts judged to call for attention are displayed. Warning parts blink in red in
image 2, while only warning parts are displayed in image 3.
Enter a pad number to display the corresponding pad.
Move to the next field of view.
Move to the previous field of view.
A pad later than the selected one by the pad number in image 3 is selected.
A pad earlier than the selected one by the pad number in image 3 is selected.
Save the current screen in an image file.
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Operation
No Name Description of displayed item and functions
5 Display selection
The data and menu alternate with tab selection.
When “Menu” is selected
[Profile disp] The profile screen is displayed. (Refer to "3.4.1 Profile Screen")
[Wide 3D]
The wide-area measurement screen is displayed.
(Refer to "3.4.2 Wide Area Measurement Screen".)
[Previous FOV]/
[Next FOC]
The field of view changes in the order of the inspection field of view.
[Save screen] The current screen images are saved in the PC of the inspection machine.
Manual Judge Change the inspection result to Good.
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When “PCB data” is selected, the image shown on the right side in the previous figure is
displayed.
Select [NG PCB List] to check the inspection record of the faulty PCB.
If "Alloc disp" is selected
The inspection result of an inspection item can be checked on the PCB image.
(Refer to "3.4.4 Alloc Disp".)
If "NG point" is selected
Detail information about the selected inspection pad is displayed. (Refer to "3.4.5 Pad info".)
6 Results of pad inspection
The results of pad inspection are displayed.
Detail The judgment results of pad inspection are displayed.
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Operation
3.4.1 Profile Screen
The items displayed in the profile screen and functions are described.
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24226-KMN-00
No Name Description of displayed item and functions
1 Display selection
Select the profile displaying style. Use the corresponding tab to select pad inspection
result, solder image or horizontal cross section.
2 3D image
The 3D image of the designated pad is displayed. The red wire frame around the pad
indicates the ideal profile based on the area of the opening of the metal mask and mask
thickness, indicating the approximate volume fill ratio. Move a finger along the 3D image to
change the displaying angle vertically or horizontally over 360° as you need.
3 2D image
This is the top view image of the pad with colored height discrimination. For the relationship
between the height and color, see the following description.
The displayed image can be selected among "Image," "Color," and "Mono."
4 Cross section graph
This is the cross section shape of the pad located at the cross on the 2D image (3). Touch
an arbitrary part of the 2D image to change the cross location. The data displayed outside
the image indicates the maximum value, minimum value and average.
5 [Prev pad] / [Next pad] button
The pad, the profile of which is displayed, is changed in the order of the pad number.
In the faulty or warning pad display mode, the previous or next faulty or warning pad is
displayed.
6 Adjust dsp height
Move the slide to adjust the solder height of the 3D image.
The height profile of the solder is intensified in the displayed image.
7 Zoom Adjust the displaying scale.
8 Ideal shape display Place a check mark to display a wire frame of the ideal shape of the solder. (See above 2).)
9 [Dsp change] button The color gradation height indication is reflected on the 3D image.
10 [Save image] button The current images are saved in the PC of the inspection machine.
11 [OK] button Exit to return to the measurement screen.
12 [Detail] button The judgment results of pad inspection are displayed.