YSi-SP_Ope_E.pdf - 第63页
2-26 2 Operation 3.4.1 Profile Screen T he items display ed in the profile screen and functions are described. 6 9 8 7 10 11 4 12 3 5 1 2 24226-KMN-00 No Name Description of displayed item and functions 1 Display selecti…
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Operation
No Name Description of displayed item and functions
5 Display selection
The data and menu alternate with tab selection.
When “Menu” is selected
[Profile disp] The profile screen is displayed. (Refer to "3.4.1 Profile Screen")
[Wide 3D]
The wide-area measurement screen is displayed.
(Refer to "3.4.2 Wide Area Measurement Screen".)
[Previous FOV]/
[Next FOC]
The field of view changes in the order of the inspection field of view.
[Save screen] The current screen images are saved in the PC of the inspection machine.
Manual Judge Change the inspection result to Good.
●
When “PCB data” is selected, the image shown on the right side in the previous figure is
displayed.
Select [NG PCB List] to check the inspection record of the faulty PCB.
If "Alloc disp" is selected
The inspection result of an inspection item can be checked on the PCB image.
(Refer to "3.4.4 Alloc Disp".)
If "NG point" is selected
Detail information about the selected inspection pad is displayed. (Refer to "3.4.5 Pad info".)
6 Results of pad inspection
The results of pad inspection are displayed.
Detail The judgment results of pad inspection are displayed.
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2
Operation
3.4.1 Profile Screen
The items displayed in the profile screen and functions are described.
6 9 87 10 11
4
12
3
5
1
2
24226-KMN-00
No Name Description of displayed item and functions
1 Display selection
Select the profile displaying style. Use the corresponding tab to select pad inspection
result, solder image or horizontal cross section.
2 3D image
The 3D image of the designated pad is displayed. The red wire frame around the pad
indicates the ideal profile based on the area of the opening of the metal mask and mask
thickness, indicating the approximate volume fill ratio. Move a finger along the 3D image to
change the displaying angle vertically or horizontally over 360° as you need.
3 2D image
This is the top view image of the pad with colored height discrimination. For the relationship
between the height and color, see the following description.
The displayed image can be selected among "Image," "Color," and "Mono."
4 Cross section graph
This is the cross section shape of the pad located at the cross on the 2D image (3). Touch
an arbitrary part of the 2D image to change the cross location. The data displayed outside
the image indicates the maximum value, minimum value and average.
5 [Prev pad] / [Next pad] button
The pad, the profile of which is displayed, is changed in the order of the pad number.
In the faulty or warning pad display mode, the previous or next faulty or warning pad is
displayed.
6 Adjust dsp height
Move the slide to adjust the solder height of the 3D image.
The height profile of the solder is intensified in the displayed image.
7 Zoom Adjust the displaying scale.
8 Ideal shape display Place a check mark to display a wire frame of the ideal shape of the solder. (See above 2).)
9 [Dsp change] button The color gradation height indication is reflected on the 3D image.
10 [Save image] button The current images are saved in the PC of the inspection machine.
11 [OK] button Exit to return to the measurement screen.
12 [Detail] button The judgment results of pad inspection are displayed.
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Operation
The solder style can be switched in the following way.
1. Cross Selection
2. Solder image
3. Cut level
PCB data: The PCB data is displayed.
Inspection result: The inspection results of the selected pad are displayed.
24228-KMN-00
The cut level image is displayed in colors corresponding to the color gradation graph.
Touch the graph to determine the height of the cross section.
Color gradation graph: [High] red <=> orange <=> yellow <=> green <=> blue [Low]