80S-2080F480F4-680F5 User’s Manual.pdf - 第249页

5 Vision Functions SIPLACE 80S-20/F4/F4-6/F5 User’s Manual 5.3 Component Vision System Edition 03/98 from Software Version SR.404.xx 5 - 28 Line engine er 5.3.1.3 Description o f Function One segm ent of the 12x placeme …

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SIPLACE 80S-20/F4/F4-6/F5 User’s Manual 5 Vision Functions
Edition 03/98 from Software Version SR.404.xx 5.3 Component Vision System
Line engineer 5 - 27
5.3 Component Vision System
The component vision system records the precise location of a component by determining on the one hand
the displacement of the center of the component relative to the nozzle’s axis of symmetry and on the other
hand by determining the board’s skew with respect to the relative rotational position of the nozzle. It is also
possible to carry out an analysis of the state of the lead configuration in both the x and y directions.
5.3.1 Component Vision System of the SIPLACE 80S-20 Placement
Machine
5.3.1.1 Description of the System
The component vision system consists of:
l the optical system for component position recognition
Each 12x revolver placement head is equipped with its own component position recognition system in star
station 7 (see Fig. 5.1.3, Page 5 - 6).
l the vision evaluation unit
Each machine is equipped with an evaluation unit for PCB and component position recognition which is
accommodated in the control unit (see Fig. 5.1.4, Page 5 - 7 and Fig. 5.1.7, Page 5 - 10).
A CCD camera with deflection mirror, imaging lens and LED lighting system constitutes the optical component
position recognition system. The effective field of view of the CCD camera (a SONY XC75) amounts to 24 x
24 mm². For position recognition or for leads testing the component is evenly illuminated by the rows of LEDs
in the reflected light process and its sharp image formed by the lens on the CCD chip. Using digital image pro-
cessing methods, the HALE process (H
igh Accuracy Lead Extraction) the parameters are determined for
position, skew and leads condition.
The vision evaluation unit (MVS) has already been described in Section 5.2.1 since it performs the two func-
tions of PCB and component evaluation.
5.3.1.2 Technical Data
Camera type: SONY XC75
Number of pixels: 484 x 484
Field of view: 24 mm x 24 mm
Method of illumination: Reflected light process (red light), 3 LED levels
Image processing: HALE gray scale process (H
igh Accuracy Lead Extraction)
Screen: RGB monitor (VGA mode) 640 x 484 pixels
Component sizes: 0.5 mm x 0.5 mm to 18.7 mm x 18.7 mm
Range of recognizable components : TSOP, LCC, PLCC, QFP, SO series through SO28
basically all components with J and
gull-wing leads, µBGAs
Minimum lead pitch: 0.3 mm
Minimum ball diameter with µBGAs: 250 µm
5 Vision Functions SIPLACE 80S-20/F4/F4-6/F5 User’s Manual
5.3 Component Vision System Edition 03/98 from Software Version SR.404.xx
5 - 28 Line engineer
5.3.1.3 Description of Function
One segment of the 12x placement head picks up a component at the star station 1. As the star advances and
further components are picked up. Star station 7 accommodates the optical unit of the component vision sys-
tem. Once it has arrived three staggered rows of LEDs evenly illuminate the component with red light. The
lens forms a sharp image of components up to a height of 5 mm on the camera’s CCD chip.
The digital component imaging generated by the component camera is transmitted to the vision evaluation
unit. Using digital image processing (HALE process) the evaluation unit compares the image of the compo-
nent with a synthetic model previously generated in the GF editor (the package form editor). The parameters
obtained from this yield information on positional deviations, leads condition and component re-identification.
The HALE process has proved to be highly resistant to interference factors such as unwanted reflections, dif-
fused light influences and so on. It is faster and more accurate than the matching method. Once measure-
ment has been completed the segment rotates the component in star station 9 into the correct orientation for
placement. In star station 1 the component is then inserted in its correct position on the board.
5.3.2 Component Vision System in the SIPLACE 80 F
4
Placement
Machine
5.3.2.1 System Description
The component vision system consists of
the optical system for component position recognition.
The
12x revolver placement head
is equipped with a component position recognition system in star station
7 (see Fig. 5.1.3, Page 5 - 6).
For the
IC placement head
, up to two component vision systems can be used. These are fixed onto the
base of the machine (see Fig. 5.1.6, Page 5 - 9). One is used for optical centering of conventional compo-
nents with pin connections. The other - with an FC sensor, optically centers flip-chips (see 'Measure Com-
ponent Option', Page 5 - 88).
the vision evaluation unit
The evaluation unit for PCB and component position recognition is accommodated in the control unit (see
Fig. 5.1.7, Page 5 - 10).
SIPLACE 80S-20/F4/F4-6/F5 User’s Manual 5 Vision Functions
Edition 03/98 from Software Version SR.404.xx 5.3 Component Vision System
Line engineer 5 - 29
Component position recognition system of the 12x revolver placement head
The 12x revolver placement head’s optical system for component position recognition has already been
described in Section 5.3.1 Page 27.
Component position recognition system for the IC head with IC sensor
All optical components of the system
– CCD camera (SONY XC77)
– Lens
– Optical bandpass filters for suppressing unwanted reflections are accommodated in a dust-tight casing.
The field of view of the CCD camera amounts to 38 x 38 mm². For position recognition or for leads testing
the IC component is evenly illuminated by three rows of LEDs in the reflected light process and its sharp
image formed by the lens on the CCD chip. Using digital image processing methods, the HALE process
(H
igh Accuracy Lead Extraction) the parameters are determined for position, skew and the leads condition
of fine-pitch components and BGAs (ball grid arrays).
Component position recognition system for the IC head with FC sensor
All optical components of the system such as
– CCD camera (SONY XC75C)
– Lens
are accommodated in a dust-tight casing. The field of view of the CCD camera amounts to 12.2 mm x 9,2 mm.
For position recognition or for the ball test, the flip-chips are illuminated by two rows of LEDs and their sharp
image projected by the lens onto the CCD chip. Using digital image processing methods, the parameters are
determined for position, skew of the component and the number and position of the balls.
The vision evaluation unit is described in Section 5.2.1 from Page 5 - 19.
5.3.2.2 Technical Data
Position recognition system for the IC head for components with lead connections
Camera type: SONY XC77
Number of pixels: 484 x 484
Field of view: 38 x 38 mm²
Method of illumination: Reflected light process (red light), 3 lighting levels
Image processing: HALE gray scale process (H
igh Accuracy Lead Extraction)
Screen: RGB monitor (VGA mode) 640 x 484 pixels
Range of detectable components: Fine-pitch up to 55 x 55 mm² and BGAs (ball grid arrays)
Minimum leads pitch: 0.4 mm