80S-2080F480F4-680F5 User’s Manual.pdf - 第309页
5 Vision Functions SIPLACE 80S-20/F4/F4-6/F5 User’s Manual 5.6 Test Component Edition 03/98 from Software Version SR.404.xx 5 - 88 Line engine er 5.6. 4.4 Measure Component Option NOTE This optio n can onl y be acti vate…
SIPLACE 80S-20/F4/F4-6/F5 User’s Manual 5 Vision Functions
Edition 03/98 from Software Version SR.404.xx 5.6 Test Component
Line engineer 5 - 87
Fig. 5.6.13 Test component menu, Test component video image
With the Return key you can call all defined individual steps in the measurement procedure one after the
other. Each time you press the Return key a measurement command is given and the results shown on
the screen.
Use Esc to quit the option. The video image closes and the Test component menu reappears.
GF No. = 5Test component
RET: Test component
5 Vision Functions SIPLACE 80S-20/F4/F4-6/F5 User’s Manual
5.6 Test Component Edition 03/98 from Software Version SR.404.xx
5 - 88 Line engineer
5.6.4.4
Measure Component
Option
NOTE
This option can only be activated if you have already loaded a package form number and a component has
been picked up.
Fig. 5.6.14 Test component menu, Measure component option
When this option is activated the following actions are started:
– The video image appears on the screen.
– The measurement command is given, using the predefined parameters.
– The MVS performs each component-specific measurement step in turn.
– The measurement values are displayed in the video image.
In addition, to conventional components with lead connections the 80F
4
, 80F
4
-6 or 80F
5
machines can also
optically center BGAs (B
all Grid Arrays) and flip-chips. The body of BGA and flip-chip components is made of
passivated silicon chips. Such bodies have strong reflective properties and their surfaces are wavy. The con-
nections of these components take the form of balls with a diameter of at least 80 µm. Ball-grid arrays have
their connections, as the name suggests, arranged in the form of a grid - this means that they can be
described in terms of rows and columns.
SIPLACE 80S-20/F4/F4-6/F5 User’s Manual 5 Vision Functions
Edition 03/98 from Software Version SR.404.xx 5.6 Test Component
Line engineer 5 - 89
With flip-chips the balls are arranged irregularly over the body of the component body. The coordinates of
each connection will therefore need to be ascertained individually.
The IC head of the 80F
4
, 80F
4
-6 or 80F
5
machine picks up the BGAs or flip-chips from flatpack magazines.
However the evaluation procedures used to date for conventional components are no longer adequate for the
optical centering of BGAs or flip-chips. For this reason new evaluation methods and new lighting techniques
have been developed for the IC sensor and FC sensor in order that this new generation of components can
be centered. BGAs and flip-chips which cannot be centered optically will be returned to the flatpack maga-
zines by the IC head.
Fig. 5.6.15 Test component menu, Measure component video image
Optical surveying of conventional components with lead connections with the 80S-20 and 80F
4
/F
4
-6/F
5
place-
ment machines:
The crosshairs indicate the component’s center. The component outlines are emphasized in color.
The measured values represent the geometric component parameters such as
– Lead skew
The value for lead skew will be indicated if you have selected the lead-driven measurement mode.
– Pitch
The value for pitch will be indicated if the corner-driven measurement mode is active as the last measure-
ment step.
– Number of leads
– x / y offset
Measure component GF No. = 5
X offset = ... Y offset = ... Phi = ...
Orthogon = ...
No. of pins = ...
Quality fact. = ...
Length[mm] = ...
Width[mm] = ...
Spacing[mm] =
RET: Measure component
P.dev.[mm] =