2OM-1733-005w_F8.pdf - 第127页
2OM-1733 2-2-1 2. Composition of Pattern Program The pattern program is composed of the following data. Pattern Program (Chapter 2) Pattern Program Common SET (3.1) PCB (3.2) Operation (3.3) Control (3.4) PL Head/Nozzle …
2OM-1733
2-1-41204-001
2OM-1733
2-2-1
2. Composition of Pattern Program
The pattern program is composed of the following data.
Pattern Program (Chapter 2)
Pattern Program
Common SET (3.1)
PCB (3.2)
Operation (3.3)
Control (3.4)
PL Head/Nozzle (3.5)
CMPNT PL (3.6,F01)
Component Library
Component ID
Placement (3.7,G01)
HDLG/PL (3.8)
Function (C01)
Mark (C02)
Operation (C03)
Set-up (C04)
Control (D01)
PCB Locate (D02)
Transfer speed (D03)
Nozzle Place (E01)
Block 1(2)
Nozzle Stk 11 (E02)
Offset (G02)
P-Data (G03)
O-Data (G04)
PCB (B01)
Un
Support Pin (C05)
PCB Recog
Set-up
Nozzle Stk 12 (E02)
Nozzle Stk 21 (E02)
Nozzle Stk 22 (E02)
Note
(3.1) to (3.8) and (B01) to (G04) show the Nos. to be referred to.
Fig. 2B2-1 Composition of Pattern Program
1212-002
2. Composition of Pattern Program
2OM-1733
2-2-2
2.1 Composition of Common SET
Note
This data is used in the dual transfer operation (option).
2.2 Composition of PCB Data
The set parameters are used to set the PCB size and reference, etc.
B01 PCB
Table 2B2-1
Items Ref. No.
PCB Size
X (Horizontal), Y (Vertical), T (Thickness)
B01_01
PCB origin offset
X (Horizontal), Y (Vertical), Z (Angle),
X/Y Coordinate Angle,
X-Direction, Y-Direction, Z-Direction
B01_02
PCB height offset B01_03
Placement Reference B01_04
Component Library Placement Offset B01_05
PCB Warpage B01_06
Lot Name B01_07
Comment 1 and Comment 2 B01_08
1212-003
2.1 Composition of Common SET