YCP10 Users_E.pdf - 第33页
3. Operation screen description 2-13 3.1 Basic configuration of operation screen 2-13 3.2 V arious buttons and parameter input grids 2-14 Chapter 3 Printing guide 1. Flow of printing condition setting 3-1 2. Data and con…
General Contents
About this manual
1. About this manual i
1.1 Revision record i
1.2 Contents of each chapter ii
1.3 Page layout iii
Chapter 1 Part names and functions
1. YCP10 main unit 1-1
2. Operation panels and data input units 1-4
2.1 Operation panel buttons 1-5
2.2 Operation display screen 1-6
2.3 Keyboard (option) 1-6
3. Printing section 1-7
3.1 Squeegee head and printing table 1-7
3.2 3S squeegee 1-8
3.3 Double squeegee (option) 1-9
4. Conveyor unit 1-10
4.1 Board clamp unit (board clamp table) 1-10
4.2 Board support 1-11
5. Cleaning unit 1-15
5.1 Cleaning unit 1-15
5.2 Suction unit 1-16
6. Vision camera unit 1-17
7. Servo-controlled axes 1-18
Chapter 2 Basic operations
1.
Canceling emergency stop/clearing error 2-1
1.1 Canceling emergency stop 2-1
1.2 Clearing an error 2-2
1.3 Typical errors and troubleshooting 2-3
2. Starting and stopping the machine 2-7
2.1 Inspecting before operation 2-8
2.2 Starting the machine 2-9
2.3 Powering off the machine 2-11
EPN119
2210
3. Operation screen description 2-13
3.1 Basic configuration of operation screen 2-13
3.2 Various buttons and parameter input grids 2-14
Chapter 3 Printing guide
1. Flow of printing condition setting 3-1
2. Data and condition setting 3-2
2.1 Material and setup information 3-2
2.2 Alignment offset setting 3-4
2.3 Rolling 3-5
2.4 Printing and production conditions 3-6
3. Details of each parameter item 3-7
3.1 Board clamp 3-7
3.1.1 Edge clamp pressure 3-7
3.1.2 Backup jig 3-7
3.2 Board transfer 3-8
3.2.1 Transfer position check 3-8
3.2.2 Board edge offset 3-9
3.2.3 Conveyor motor (board transfer) speed 3-11
3.2.4 X-axis movement during board transfer 3-12
3.2.5 Transfer start height 3-13
3.3 Board and mask mark recognition (Mark position) 3-14
3.4 Alignment offset 3-14
3.5 Squeegee (Rolling) 3-15
3.5.1 Squeegee speed 3-15
3.5.2 Squeegee pressure 3-15
3.5.3 Attack angle (degree (°)) 3-15
3.6 Solder supply interval 3-16
3.7 Detach pattern 3-16
3.7.1 Board separation speed 3-16
3.7.2 Board separation distance 3-17
3.8 Cleaning 3-17
3.8.1 Cleaning interval 3-17
3.8.2 Cleaning repeat 3-17
3.8.3 Cleaning speed 3-17
4. Causes of troubles by symptoms 3-18
4.1 Positional deviation 3-18
4.2 Blur 3-18
4.3 Insufficient filling 3-18
4.4 Solder spread, solder bridge 3-19
4.5 Scraping trouble 3-19
4.6 Solder enlargement 3-19
4.7 Solder chipping, mask remaining 3-19
Chapter 4 Daily operation
1. Overview 4-1
2. Starting and warming up the machine 4-2
3. Selecting the board data 4-4
4. Changing the conveyor unit setup 4-5
5. Replacing the cleaning gauze roll 4-7
5.1 Using the same roll size 4-8
5.2 Changing the roll size 4-9
6. Refilling the cleaning solvent 4-12
6.1 Precautions when handling cleaning solvent 4-12
6.2 Refilling the cleaning solvent 4-12
6.3 Long-term storage tasks 4-14
7. Compatible masks 4-15
7.1 Mask size and mask stopper pin position 4-15
7.2 Mask frame dimensions and mask standard position 4-16
7.3 Using the mask adaptor 4-17
8. Setting up the mask and squeegee 4-19
9. Rolling operation 4-21
10. Starting board production 4-24
11. Finishing board production 4-33
Chapter 5 Creating and setting the data
1. Creating new data 5-1
2. Basic data setting 5-3
2.1 Configuration of [Basics] tab screen 5-3
3. Board data setting 5-5
3.1 Board marks and parameter setting 5-5
3.2 Board data detail setting 5-11