MV-9_Chapter 5. Teaching.pdf - 第25页
错误 ! 使用“开始” 选项卡将 제목 2 应用于要在此处显示的文字。 错误 ! 使用“开始”选项卡将 제목 2 应用 于要在此处显示的 文字。 . 5- 25 [Figure 5- 17 Examples of normal chip and lif ted chi p] ( Judged as normal ) ( Judged as normal ) ( a ) norm al Basic electrode co lor map…
MV-9 User Manual
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Color image
(a) Default setting
(b) S area
expansion
(c) H area
expansion
(d) binarization lowly
[Figure 5-16 Image binarization result by color map adjustment]
3) Applying soldering inspection
- As described above, binarization to which color map is applied can be usefully and
effectively used for soldering inspection that includes various color information. Added to
that, normal inspection can be done through correct color extraction using color map, in
other words, characteristic extraction, and efficiency of inspection algorithm can be
maximized.
- The following is the color map application to detect lifted defect during chip color
inspection.
① [Figure 5-34] shows example of normal R chip and lifted defect R chip. When we
conduct teaching of chip color inspection window, basic color map of [Figure 5-35]-(a)
will be applied to segment electrode and pad area by color. By conducting trial
inspection, both of 2 chips will be judged as normal by chip color inspection algorithm.
② Red area of area next to right electrode of lifted defect chip must be emphasized to
detect lifted defect. As shown in [Figure 5-34], we can see distribution of red, yellow and
light green in lifted area. Hence, as shown in [Figure 5-35]-(b), we adjust color map to
include color of lifted area in color map. Additionally, set threshold for binarization at
high value to delete unnecessary color area information.
③ As a result, red information of lifted defect area is expanded and judged as defect.
错误!使用“开始”选项卡将 제목 2 应用于要在此处显示的文字。错误!使用“开始”选项卡将 제목 2 应用
于要在此处显示的文字。 .
5-25
[Figure 5-17 Examples of normal chip and lifted chip]
(Judged as
normal)
(Judged as
normal)
(a) normal
Basic electrode color map
Basic pad color map
(Judged as
normal)
(Judged as
defect)
(b) lifted defect
Modified electrode color map
Modified pad color map
[Figure 5-18 Example of modification of color map for lifted detection]
MV-9 User Manual
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5.3.2. Mounting inspection window
Mounting inspection window is used to inspect items like position secession or non-mounting,
wrong mounting for interesting component.
1) Teaching method
① Click <mounting inspection window> button among operating buttons.
② Draw inspection window in interesting component, and select light type and image type that
clearly divide component from PCB.
③ Select one of R (Red), G (Green), B (Blue) or L (Luminance) for image type. [Figure 5-37]
shows gray image according to image types.
[Figure 5-19 Screen to create mounting inspection window]