MV-9_Chapter 5. Teaching.pdf - 第60页
MV -9 Use r Manual 5- 60 In case red ratio in pin (lead ) inspectio n are a is sm al ler than reference value , inspect insufficient so l der , e x cessi ve solder and no pin exposure defect using shape of red area in …
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4) Good/defect judgment rule
- Soldering shape of pin type is almost similar, and most of pin exposure can be clearly
recognized. However, soldering shapes of lead type are very various according to lead
amount, and many times image does not displayed according to bending angle of lead
even in normal soldering status. Hence, use a lot of information for more correct inspection
and good/defect judgment.
Pin type inspection sequence
Perforation inspection will be independently conducted in color inspection window.
For multi-pin type, no solder, inspect insufficient solder, excessive solder defect using
blue ratio in soldering inspection area and red ratio in pin (lead) inspection area.
For pin type, inspect no solder, insufficient solder, excessive solder and no pin exposure
defect using red ratio in pin (lead) inspection area and blue ratio in excessive solder
inspection area according to blue ratio of soldering inspection area.
Lead type inspection sequence
Perforation inspection will be independently conducted in color inspection window.
In case of lead type, if lead is exposed, judge as good. Exposed lead appears in red in
color image. However, in many cases, lead does not appeared in red by bending angle
of lead and lead amount in normal soldering status.
Red ratio in pin (lead) inspection area is larger than reference value. Judge good/defect
using blue ratio and red ratio in soldering inspection area.
MV-9 User Manual
5-60
In case red ratio in pin (lead) inspection area is smaller than reference value, inspect
insufficient solder, excessive solder and no pin exposure defect using shape of red area
in soldering inspection area, blue ratio in excessive solder inspection area.
5) Teaching guide
Use frame compensation mark
- There are many wave soldering surface statuses, and we have to register many sample
images to use mounting inspection.
- Characteristic of high position precision (pattern, through hole, etc) is used for frame
compensation mark. Through hole sometimes blocked by solder. Hence, we set both of the
first and second.
- Select color light, and select type that has lowest noise value for image type. (In general, L
type)
- Considering there is much flux on substrate surface due to characteristic of wave soldering,
selection of horizontal light shows the best display. However, use color image for
inspection speed if it‟s possible.
[Figure 5-64 Setting example of frame compensation mark]
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Adjusting color map
- Since each of RGB will be independently adjusted in color map (center position, angle),
overlapping is possible.
- To detect defect of excessive solder characteristic on small pad below 3mm of diameter,
included in red area to 90 degree in green area. (Minimize it because green area is not
used.)
- Map adjustment using defect sample of excessive solder characteristic is the most
effective method.
- Important adjustment item to judge good/defect of sample within good/defect judgment
boundary.
Component
type
Color image
Preview image
Color map setting status
pin type
lead type
[Figure 5-65 Example of color map adjustment using excessive solder characteristic defect]
Inspection area setting
- Circle region (green circle in soldering inspection area)
Exterior part has not big influence to good/defect judgment during real inspection, and
the area has high occurrence rate of false defect due to flux and others. Hence,
diameter of about 80% of real pad size is recommended.
Especially, in case of pin type with big diameter, pad exterior part appears in read as
shown in the figure below, and it will be excluded from inspection area.
Since position compensation is not conducted for center position of circle region using
mounting inspection, correctly locate it at pad center as close as possible.
Blue ratio and red ratio will be changed by the size of circle area. Hence, this is an
important adjustment item to judge defect as normal or normal as defect within
good/defect judgment boundary.