MV-9_Chapter 5. Teaching.pdf - 第82页
MV -9 Use r Manual 5- 82 In general, solder ba ll has sm a ll size com paring to tota l inspection a rea . Hence , check at white pix el inspe ct i on rather than ratio and enter size value of solder ba l l by num ber …
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5-81
solder ball on pad
solder ball on substrate
solder ball on LED
substrate
[Figure 5-87 solder binarization preview image]
Preview
- This is to display preview image during binarization, select pad or solder.
Add ‘Don’t care rectangle’
- This function is to set „Don‟t care region‟.
solder ball on pad
solder ball on substrate
solder ball on LED substrate
[Figure 5-88 Add ‘Don’t care rectangle’]
Normal criteria
- Max solder amount: Enter reference value to judge good/defect
- White pixel inspection: make good/defect judgment based on number of pixel of solder ball
area.
If white pixel inspection is checked, max solder amount is inspected based on the
number of white pixel of area that is separated by solder ball. If it is not checked,
inspected based on ratio.
Solder ball area comparing to ratio of pad area is displayed during detecting solder
ball on pad for ratio inspection. Solder ball area comparing to ratio of whole
inspection window area for detection of solder ball on substrate.
MV-9 User Manual
5-82
In general, solder ball has small size comparing to total inspection area. Hence,
check at white pixel inspection rather than ratio and enter size value of solder ball
by number of pixel for inspection.
② Inspection result in status screen
Solder ball on pad inspection result
- LeadBall Counting: solder ball inspection algorithm.
- No of Blobs = 3: number of white area displayed in pad Bridge binarization result image.
- Max LeadBall Percentage: ratio of detected solder ball
- Failure – LeadBall is larger than 15: detected solder ball (ratio or number of white pixel) is
larger than reference value 15 and detected as defect.
- Label X: No allotted for No of Blobs = 3. Label 1 is excluded because it is included in „Don‟t
care region‟ setting.
- Die: total area of pad area of Label No X (number of white pixel).
- Solder: area of solder ball detected above Label No X (number of white pixel).
- Ratio: Ratio of solder to die.
[Figure 5-89 Inspection result of solder ball on pad]
Solder ball on substrate inspection result
- Label X: No allotted to solder ball target detected in solder binarization result image.
- Solder: area (number of white pixel) of Label X solder ball.
- Ratio: Ratio of solder to inspection window area.
[Figure 5-90 Solder ball on substrate inspection result]
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6) Tap inspection
- Tap inspection is algorithm to detect foreign material on pad and solder ball defect.
① Teaching method
(a) Draw binary inspection window in inspection area and select tap inspection for inspection
type.
(b) Select preview in operation window.
(c) Select manual binarization for normal criteria – preview and select default light type and
image type.
(d) Set manual binarization type and binarization value to display tap area in white and to
separate defect over tap to black checking preview image.
(e) Adjust size filtering and space filling for noise removal.
(f) Select auto binarization in normal criteria – preview, and select light for auto binarization.
(g) Conduct trial inspection to display the current value of auto binarization. Adjust min and
max value range based on current value to display defect in black.
(h) Adjust size filtering and space filling for noise removal.
(i) Select binarization or average value or binarization and average value.
(j) Set detection condition for good/defect judgment.