MV-9_Chapter 5. Teaching.pdf - 第3页

错误 ! 使用“开始” 选项卡将 제목 2 应用于要在此处显示的文字。错误 ! 使用“开始”选项卡将 제목 2 应用于要在此处显示的文字。 . 5-3 5.1.Mounting PCB ................. 5-6 5.1.1.Ex ecuti ng program ............................................................................…

错误!使用“开始”选项卡将 제목 2 应用于要在此处显示的文字。错误!使用“开始”选项卡将 제목 2 应用

于要在此处显示的文字。 .

5-3

5.1.Mounting PCB ................. 5-6

5.1.1.Executing program .......................................................................................... 5-6

5.1.2.Mounting PCB ................................................................................................. 5-6

5.2.Creating and opening PCB model ............... 5-10

5.2.1.Creating new model ....................................................................................... 5-10

5.2.2.Opening the existing model ........................................................................... 5-19

5.2.3.Modifying model ............................................................................................ 5-20

5.3.Component teaching ............... 5-21

5.3.1.Basic color concept ....................................................................................... 5-22

5.3.2.Mounting inspection window ................................ ................................ .......... 5-26

5.3.3.Solder inspection window .............................................................................. 5-35

5.3.4 Optical character inspection window ............................................................. 5-64

5.3.5.Binary inspection window............................................................................... 5-68

5.3.6.IC/Bridge inspection window ........................................................................ 5-106

5.3.7.Color inspection window ................................ ................................ .............. 5-141

5.3.8.Chip component inspection window ............................................................ 5-151

5.3.9.Height inspection window ............................................................................ 5-156

5.3.10.Lifted inspection window ............................................................................ 5-159

5.3.11.Resistance color band inspection window .................................................. 5-161

5.3.12.IC offset inspection window ....................................................................... 5-167

5.3.13.Chip color inspection ................................................................................. 5-176

5.3.14.Teaching by using side viewer ................................................................... 5-191

5.3.15.Teaching by using divided light .................................................................. 5-192

5.4.LED BLU inspection ............. 5-193

5.4.1.Teaching of LED package with reference point ............................................ 5-196

5.4.2.Teaching of LED package with no reference point ....................................... 5-205

5.4.3.Finding center position of LED package ...................................................... 5-214

5.5.Additional teaching function ............. 5-220

5.5.1.Functions in whole PCB image screen ........................................................ 5-220

5.5.2.Functions in frame image screen ................................................................. 5-237

5.5.3.Additional functions during inspection window selection .............................. 5-242

5.5.4.Additional functions during multiple inspection window selection ................ 5-245

5.6.3D Teaching ............. 5-249

5.6.1.Selection of Window for Mounting Inspection .............................................. 5-249

5.6.2.Selection of “Use 3D Inspect “Option ........................................................... 5-249

5.6.3.Projector Selection ................................................................ ....................... 5-249

5.6.4.Selection of Mounting Type .......................................................................... 5-250

5.6.5.Position Setting ............................................................................................ 5-250

5.6.6.Part Information Measurement .................................................................... 5-251

MV-9 User Manual

5-4

5.6.7.Criteria Setting ............................................................................................. 5-251

5.6.8.Inspection Results ....................................................................................... 5-252

5.6.9.Reliability Threshold ................................ ................................ .................... 5-253

5.7.Odd Parts ............. 5-254

5.7.1.Selection of Window for Mounting Inspection .............................................. 5-254

5.7.2.Selection of “Use 3D Inspect “ Option .......................................................... 5-254

5.7.3.Projector Selection ...................................................................................... 5-254

5.7.4.Selection of Mounting Type ................................ ......................................... 5-255

5.7.5.Position Setting ............................................................................................ 5-255

5.7.6.Part information Measurement .................................................................... 5-256

5.7.7.Criteria Setting ............................................................................................. 5-256

5.7.8.Inspection Results ....................................................................................... 5-257

5.7.9.Reliability Threshold .................................................................................... 5-258

5.8.IC Lead ............. 5-258

5.8.1.Selection of Window for IC/Bridge Inspection .............................................. 5-258

5.8.2.Lead Direction .............................................................................................. 5-259

5.8.3.Setting of Parameters for Lead Seq. and Bridge Insp. ................................ 5-259

5.8.4.Setting of Lead-tip Offset and Lead Offset ................................................... 5-260

5.8.5.Use Color Map ............................................................................................. 5-260

5.8.6.Projector Selection ................................................................ ....................... 5-261

5.8.7.Measurement of Lead Height Information .................................................... 5-261

5.8.8.Setting of Criteria and Expanded Region ..................................................... 5-262

5.8.9.Inspection Results ....................................................................................... 5-263

5.9.BLU ............. 5-265

5.9.1.Selection of Window for Mounting Inspection .............................................. 5-265

5.9.2.Selection of “3D BLU Inspect “ Option ......................................................... 5-265

5.9.3.Projector Selection ................................................................ ....................... 5-265

5.9.4.Selection of LED PKG. Type ........................................................................ 5-266

5.9.5.Position Setting ............................................................................................ 5-267

5.9.6.LED PKG. Information Measurement ........................................................... 5-268

5.9.7.Criteria Setting ............................................................................................. 5-269

5.9.8.How to Use Markers .................................................................................... 5-270

5.9.9.Teaching Method in case of No Markers (Use RectCenter) ......................... 5-274

5.9.10.Inspection Results ..................................................................................... 5-276

5.9.11.Automatic Teaching .................................................................................... 5-278

5.10.Height Checker ............. 5-282

5.10.1.Selection of Window for Height Inspection................................................. 5-282

5.10.2.Projector Selection ..................................................................................... 5-282

5.10.3.Selection of Reference Position ................................................................. 5-283

5.10.4.Designation of Reference Position ............................................................. 5-283