MV-9_Chapter 5. Teaching.pdf - 第48页
MV -9 Use r Manual 5- 48 5.3.3.2. Color i nspe cti on 1) Crack inspection - Crack inspection algorithm is to detect crack defect of BGA surface or other com ponents. - Crack chara c teristic Chi pping or C rack part …
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- Inspection Type: name of inspection window.
- Condition: status of binarization setting.
- Red Ratio: ratio of red pixel in inspection window. It means ratio of pixel relevant to
exposed pad.
- Non-mounting defect at which is mounted but sprang off can be detected if chip electrode
is not selected. However, but defect at which chip is not mounted can‟t be detected.
[Figure 5-50 Non-mounting inspection (mounting) in status screen – result when chip inspection
check is not selected]
[Figure 5-51 Non-mounting inspection (mounting) – result example when chip inspection check is
not selected]
MV-9 User Manual
5-48
5.3.3.2. Color inspection
1) Crack inspection
- Crack inspection algorithm is to detect crack defect of BGA surface or other components.
- Crack characteristic
Chipping or Crack part appears relatively lighter Red or lighter Blue than normal
surface in color light and appears relatively brighter or darker than normal surface
in white light.
The figure below shows normal image and Chipping or Crack defect image.
BGA
CSP
normal
normal
normal
normal
defect – vertical light
defect - horizontal
light
defect - color light
defect - color light
[Figure 5-52 Normal image and crack defect image]
① Teaching method
(a) Draw on solder window on inspection target area of a component. In general, set whole
chip package as an inspection area.
(b) Select color inspection and select crack in component type.
(c) Select horizontal + vertical light for light type, and select A (all band = R+G+B) or L for
image type. In case of white light, use horizontal or vertical light that shows well and
select L for image type.
(d) Use color map and binarization to separate crack defect of BGA or CSP.
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(e) Select inside or outside as normal range.
(f) Set crack inspection criteria.
CSP crack defect
CSP normal
[Figure 5-53 Screen to create color inspection – crack inspection window]
② Parameter of color inspection – crack inspection window
- Inspection type
Select color inspection to inspect crack defect of BGA or CSP.
- Light type and image type
In general, select horizontal + vertical light, and select A or L for image type.
However, since there are various shapes of defect, other lights (vertical or
horizontal) and select light and image type in which defect can be separated will by
changing image type.
If defect is not separated well in default light, use user light.