N7201A616E00_0317.pdf - 第327页
NPM-W 2 EJM7DE-MB-05O-0 0 5-2-1 Setting soft s witc hes Operating procedure 5-2-1 A Parameter s ettings requir ed for sold er inspection by the ins pection head is explained her e. A With ON s elected, the inspection fun…
NPM-W2 EJM7DE-MB-05O-00
Over-
view
5-1-3
Inspection
specifications
Operating procedure
5-1-3
Camera resolution 18 μm (Type A): Solder for chip component 100 x 150 μm or larger
Solder for package component φ150 μm or larger
Camera resolution 9 μm (Type B): Solder for chip component 80 x 120 μm or larger
Solder for package component φ120 μm or larger
■Target solder size
Component points: 10,000 points (the number of NPM-W2 placement data components)
Solder points: 30,000 points (the number of holes of mask hole data)
●Create the solder inspection data by converting and being tied the NPM-W2 production data to the
mask hole data (Gerber data)
■Number of available inspection points
■Inspection type
No. Inspection type Inspection target Criteria
1
Fill
・Amount of solder is too short ・Judged as nonconforming if
measurement area ratio is less than
lower limit threshold
1)
.
2
Pervasion
・Amount of solder is too much ・Judged as nonconforming if
measurement area ration is exceed the
upper limit threshold.
3
Position
・Solder position is misaligned ・Judged as nonconforming if an amount
of measurement position misalignment
is exceeded the tolerance.
4
Bridge
・Bridged with adjacent solder ・Judged as nonconforming if the
measurement bridge width is exceeded
the tolerance bridge width.
5
Shape
・Bad solder shape ・Judged as nonconforming if the
measurement solder circumscribed
rectangle size is exceeded the tolerance.
The following items are inspected in comparison with the value measured for solder inspection based on
the hole area, the hole position (area center of gravity) and the hole size of the Gerber data for a mask
used for inspection data creation.
1) Defective solder: solder judged as nonconforming with the inspection head, or solder considered as
nonconforming by an operator.
NPM-W2 EJM7DE-MB-05O-00
5-2-1
Setting soft switches
Operating procedure
5-2-1
A
Parameter settings required for solder inspection by the inspection head is explained here.
A
With ON selected, the inspection function is
enabled.
Inspector
B
B
With ON selected, the over judgment check
input function is enabled.
Over judge check
Produc-
tion
Configu-
ration
Solder
inspection
NPM-W2 EJM7DE-MB-05O-00
Produc-
tion data
and
teach
5-3-1-1
Overview
Operating procedure
5-3-1
■Teaching flow
Creating the production data
(inspection FPV data)
Loading the production data
Capturing the images of the
teaching PCB
Setting with the 2D inspection
editor
Created by NPM-DGS
Edited with NPM-DGS
Operated by the machine
This section describes teaching that is intended to conduct solder inspection.
For the purpose of judging whether solder is on board or not, teaching of solder colors is conducted on NPM-
DGS. The teaching of solder colors is judged by taking the images of solder on board using the inspection
head.
[2D inspection editor] of the NPM-DGS is used to edit production data after inspection.
●NPM-W2 system equipped with the inspection head can configure only the [Setting of soft switches].
The mouse, keyboard, or monitor connected to the system unit of NPM-W2 or the inspection BOX cannot
be used to edit production data.