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Settings Other Settings 5.6.5 Calibration 356 Service Manua l SIPLACE X Series 5.6.5.2 5 . 6 . 5 . 2 C a lib r a t io n P r o c e d u r e Calibration Procedure C&P calibration procedure

Settings

5.6.5 Calibration Other Settings

Service Manual SIPLACE X Series 355

5.6.5

5.6.5 Calibration

Calibration

Overview

This calibration step first measures the component camera. This determines the relationship of "camera

pixel size to resolution of machine measuring system (X,Y)", the "camera center point in X and Y direc-

tion" and the "torsion angle of the CCD sensor in the camera". This is following by determining the head

offset and the segment offsets for the top and bottom.

▪ Head offset: the head offset is the distance between the PCB camera and the nozzle (segment 1).

The target is a fixed value (X=0 and Y=-105 mm), to which an offset value (from the head calibration)

is added.

▪ Segment offset top: the top segment offset involves turning the calibration tool in the component

camera in 0, 90, 180 and 270° steps. The value determined is that of the rotating center of the nozzle

tip in relation to the component camera center in the X and Y direction.

▪ Segment offset bottom: the bottom segment offset involves recording and measuring the calibration

tool in the 0, 90, 180 and 270° positions. The value determined is that of the rotating center point of

the nozzle tip when the Z axis is extended in relation to the PCB camera. Segment 1 forms the ref-

erence (X=0, Y=0) to the other segments.

5.6.5.1

5.6.5.1 Calibrating the Heads and Cameras

Calibrating the Heads and Cameras

► Switch over to the operator level Service (Customer).

► Switch over to the Service menu and select Ma-

chine calibration or Automatic calibration (depending

on SW version).

► Select 8. Head and cameras and click on Next.

► On the next page, select the gantries on which the

heads to be calibrated are located and then click on

Next.

► The next step is to check the calibration conditions

(nozzle, calibration tool etc.). Follow the instructions

provided.

After this step, calibration will begin. All required interme-

diate steps (head height etc.) will be performed automat-

ically.

Settings

Other Settings 5.6.5 Calibration

356 Service Manual SIPLACE X Series

5.6.5.2

5.6.5.2 Calibration Procedure

Calibration Procedure

C&P calibration procedure

Settings

5.6.6 DIP Switch for Camera Types 25 and 33 Other Settings

Service Manual SIPLACE X Series 357

5.6.6

5.6.6 DIP Switch for Camera Types 25 and 33

DIP Switch for Camera Types 25 and 33

Setting

► Switch off the machine, disconnect it from the power supply and secure it to prevent unauthorized

reactivation. Observe the instructions in section "1.2 Preparatory Work..." [ ➙ 15].

► Remove the camera upper part and the cover on the lower part, to gain access to the DIP switches.

► Set the DIP switches. (see below)

► Fit all parts by following the above instructions in the reverse order.

DIP switch

Boards with version status 01 and 02 are fitted with a TQ module. In this case, the DIP switching block

is 8 pin.

Boards with version status 03 or higher do not have a TQ module. In this case, the DIP switching block

is 6 pin.

Version state 01 and 02: DIP switch settings (8 pin)

* Not all gantries may be available, depending on the machine type.

Version state 03 and higher: DIP switch settings (6 pin)

* Not all gantries may be available, depending on the machine type.