YSP20_Users_E.pdf - 第113页
4-21 4 aily operation 4 F ollow the message on the screen to load a board on the con vey or . This step is skipped when a board has al ready been clamped on the conveyor . After the board is clamped, the boar d fiducia…
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aily operation
8. Rolling operation
In rolling operation, the squeegee head moves back and forth repeatedly in order to roll and agitate solder
on the mask until it becomes suitable for printing. Rolling operation is recommended in cases where you first
print after supplying solder on the mask or when solder has been left on the mask for a long time while not in
operation.
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NOTE
The board surface becomes soiled during rolling operation, so we recommend covering the board surface with a
transparent sheet (available as option). After rolling operation, clean the backside of the mask by automatic or
manual cleaning.
1
Supply solder.
1. Press the [SW Prod. Position] button on the Setup screen.
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NOTE
When both lanes are used for production, the dialog box for selecting the lane number appears, so select the lane.
The lane currently used in production is grayed out.
2. Select “Solder Setup” and press the [OK] button.
When the DOOR LOCK lamp turns off, open the safety cover and supply solder on the mask.
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immediately in case of emergency.
2
Press the [READY] button.
Close the safety cover and press the [READY] button.
3
Press the [Rolling] button on the [Setup] tab of the Setup screen.
[Rolling] button
[Rolling] button
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4
Follow the message on the screen to load a board on the conveyor.
This step is skipped when a board has already been clamped on the conveyor.
After the board is clamped, the board fiducial mark will be automatically recognized with the vision
camera. (This mark recognition will be skipped if not using the fiducial mark function.)
Fiducial mark recognition screen
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5
Check that the Rolling dialog box appears.
After mark recognition is complete, the mark recognition screen automatically closes. The conveyor
table then moves to the printing position and is fixed, and the Rolling dialog box appears as shown
below.
Rolling dialog box
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6
Check the squeegee print direction.
Use the [Squeegee Direction] button as needed to change the print direction according to the position
where solder was supplied.
7
Start rolling operation.
1. Press the [Stop after time over] button and enter the rolling time.
2. Press the [Start] button.
Rolling operation starts and will automatically stop when the time you set is reached.
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NOTE
Check the scraped state of the solder on the mask during rolling operation, and if necessary, adjust the settings as in
the next step.
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8
Adjust the settings by checking the rolling state.
Press the [Stop] button in the Rolling dialog box to temporarily stop the rolling operation, and enter the
optimum values in the Squeegee Pressure and Squeegee Speed parameters.
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NOTE
Set the Squeegee Speed and Squeegee Pressure parameters by checking how solder on the mask is scraped during
rolling operation. If the solder is not sufficiently scraped, increase the squeegee pressure and reduce the squeegee
speed. But, note that an excessive squeegee pressure level will cause the solder to spread beyond the required area
or will scrape away the solder too much.
9
Press the [Close] button when rolling operation is finished.
A dialog box for selecting auto cleaning appears after the rolling dialog box is closed.
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Clean the mask by following the message on the screen.
Select the cleaning method (“Dry”, “Wet” or “Detail …1 to 4”) and press the [OK] button.
When you press the [OK] button after selecting any of “Detail …1 to 4”, cleaning will start according to
the conditions that are set on the [Controlled …1] to [Controlled …4] tabs of the “Cleaning Detail
Setting” screen. However, if the “Detail Auto interval” is set to “0”, the condition items are not displayed.
The cleaning unit starts moving to automatically clean the backside of the mask.
TIP
For information on the “Detail …1” to ”Detail …4” settings, see "6. Cleaner data setting" in Chapter 5.
[Automatic Cleaning] screen
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TIP
If you want to perform manual cleaning, press the [Manual Cleaning] button and follow the message that appears.
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Follow the message on the screen to unload the board.