YSP20_Users_E.pdf - 第193页
6-18 6 anaging the data 3.3 MIS: Program Log Selecting the [Program Log] tab shows a list of production results obtained with eac h program (board dada). A lot is defined as production that starts with one program (boa…
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Mask Mark Rec CT Time (seconds) required for recognizing marks on the mask frame.
Inspection Time
Time (seconds) required for automatic inspection of printed state on each board.
(Not currently supported)
Cleaning Time Time (seconds) required for automatic cleaning of each board.
Stencil 1 cleaning
Cleans Stencil 1 when dual-stencil printing is used.
0: Does not perform cleaning.
1: Performs cleaning before printing solder.
2: Performs cleaning before unloading board after printing solder
3: Performs cleaning before and after printing solder and also before unloading
board.
Stencil 2 cleaning
Cleans Stencil 2 when dual-stencil printing is used.
0: Does not perform cleaning.
1: Performs cleaning before printing solder.
2: Performs cleaning before unloading board after printing solder
3: Performs cleaning before and after printing solder and also before unloading
board.
Mark Vision Error
Number of mark recognition errors that occurred during operation (including
retry count) count.
Transfer Error Number of board transfer errors that occurred during operation.
Other Error Number of other errors that occurred during operation.
Stop Number Number of errors that stopped the machine during operation.
Operator Call Time
Machine stop time (seconds) from when an error occurred during operation until
the error was cleared.
Recovery Time Time required for the machine to restart after clearing the error.
Operator Stop Time (sec)
Time (seconds) during which the machine was stopped by operator during
production.
Standby Time for Other
Lane (sec)
Time (seconds) during which the specified lane was in standby during production
due to operation of the other lane.
Board Inspection
The following log entries are recorded by machines with a solder-print inspection
function.
0: Passed inspection
1: Failed inspection
Board Distortion Check
0: No distortion found
1: Distortion found
Board Remove
0: Board not removed
1: Board removed
Board Reentry
0: Board not loaded
1: Board loaded
Feedback Print
0: Feedback print not performed
1: Feedback print performed
Feedback Cleaning
0: Feedback cleaning not performed
1: Feedback cleaning performed
Rolling width
Rolling width measured after this board was printed.
This is output only when the PSC function is used.
The initial value will be output if an error occurs.
Solder supply amount
Solder supply amount after this board was printed.
This is output only when the PSC function is used.
The initial value will be output if an error occurs.
Board ID Identification number of each board (board ID) that was printed.
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3.3 MIS: Program Log
Selecting the [Program Log] tab shows a list of production results obtained with each program (board dada). A
lot is defined as production that starts with one program (board data) and ends when the program is switched
to another program (board data). One set of production results is listed as a program lot in one data row. Up to
1000 rows can be listed.
The [Save Log], [Clear] and [Option] buttons at the lower right have the same functions as the [Error Log] tab.
[MIS]-[Program Log] tab
Select the lane.
64611-N3-00
Each parameter item shows the following information.
Program Name Name of program used for board production.
Program ID Comment on program used for board production.
Production Type
Production type used for this solder printing process.
Not specified: No production type was specified.
Single: Boards were printed on single lane.
Parallel: Boards were printed in parallel on Lane 1 and Lane 2.
Alternate: Boards were printed alternately on Lane 1 and Lane 2.
Sequential: Boards were printed sequentially using Lane 1 and Lane 2.
Print Lane Lane number that issued the log for this lot.
Carry-out Lane Lane number from which the boards for this lot were unloaded.
Program Date Date and time when program (board data) was last changed and saved.
Start Time Time when production changeover was done.
Setup Date
Time when automatic operation was first started with the START button after the
setups were complete. (If operation failed to start due to data errors, this is not
recorded as the setup date even when the START button was pressed.)
Finish Date
Time when program (board data) was switched to another program or power was
turned off.
Board Count Max.
Number of boards scheduled to be produced. (If this data was changed during
production, the most recent data is shown.)
Produced Board
Number of boards that were actually produced until program was switched or
production was finished.
Number of boards unloaded to
Lane 1
Number of boards unloaded to Lane 1.
Boards that were removed while waiting for unloading are not counted.
Boards that were returned to the conveyor and then unloaded are counted.
Number of boards unloaded to
Lane 2
Number of boards unloaded to Lane 2.
Boards that were removed while waiting for unloading are not counted.
Boards that were returned to the conveyor and then unloaded are counted.
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Print CT Max Longest time (seconds) required to print solder on a board in each program lot.
Print CT Min Shortest time (seconds) required to print solder on a board in each program lot
Print CT Ave Average time (seconds) required to print solder on a board in each program lot.
Transfer CT Max Longest time (seconds) required to transfer a board in each program lot.
Transfer CT Min Shortest time (seconds) required to transfer a board in each program lot.
Transfer CT Ave Average time (seconds) required to transfer a board in each program lot.
Upstream Standby CT Max
Longest standby time (seconds) spent to produce a board in each program lot,
due to the upstream machine.
Upstream Standby CT Min
Shortest standby time (seconds) spent to produce a board in each program lot,
due to the upstream machine.
Upstream Standby CT Ave
Average standby time (seconds) spent to produce a board in each program lot,
due to the upstream machine.
Downstream Standby CT Max
Longest standby time (seconds) spent to produce a board in each program lot,
due to the downstream machine.
Downstream Standby CT Min
Shortest standby time (seconds) spent to produce a board in each program lot,
due to the downstream machine.
Downstream Standby CT Ave
Average standby time (seconds) spent to produce a board in each program lot,
due to the downstream machine.
Mark Rec CT Max
Longest mark recognition time (seconds) required to produce a board in each
program lot.
Mark Rec CT Min
Shortest mark recognition time (seconds) required to produce a board in each
program lot
Mark Rec CT Ave
Average mark recognition time (seconds) required to produce a board in each
program lot.
Mask Mark Rec CT Max
Longest mask mark recognition time (seconds) required to produce a board in
each program lot.
Mask Mark Rec CT Min
Shortest mask mark recognition time (seconds) required to produce a board
during each program lot.
Mask Mark Rec CT Ave
Average mask mark recognition time (seconds) required to produce a board in
each program lot.
Inspection Time
Total time in seconds required to inspect boards in each program lot. (Available
when solder-print inspection is used.)
Inspection Time Max
Longest time (seconds) required to inspect one board in program lot. (Available
when solder-print inspection is used.)
Inspection Time Min
Shortest time (seconds) required to inspect one board in program lot. (Available
when solder-print inspection is used.)
Inspection Time Ave
Average time (seconds) required to inspect one board in program lot. (Available
when solder-print inspection is used.)
Cleaning Time Time (seconds) required for automatic cleaning in each program lot.
Mark Vision Error
Number of mark recognition errors that occurred in program lot (including retry
count).
Transfer Error Number of board transfer errors that occurred in program lot.
Other Error Number of other errors that occurred in program lot.
Operator Call Time
Total machine stop time (seconds) from when an error occurred until it was
cleared.
Recovery Time Total time (seconds) required until the machine restarted after clearing the error.
Operator Stop Time (sec)
Time (seconds) during which the machine was stopped by operator during
production.
Standby Time for Other Lane (sec)
Time (seconds) during which the specified lane was in standby during production
due to operation of the other lane.
Upstream Standby Time
Total standby time (seconds) required by the upstream machine during
production (including cases where the machine had no board in printing position
waiting for a board from the upstream machine while the preceding board was
on the exit conveyor waiting for carry-out signal from the downstream machine).