YSP20_Users_E.pdf - 第114页

4-22 4  aily operation 8 Adjust the settings b y checking the rolling state. Press the [Stop] button in the Rolling dia log box to temporarily stop the rolling operation, and en ter the optimum values in the Squeegee Pr…

100%1 / 280
4-21
4
aily operation
4
Follow the message on the screen to load a board on the conveyor.
This step is skipped when a board has already been clamped on the conveyor.
After the board is clamped, the board fiducial mark will be automatically recognized with the vision
camera. (This mark recognition will be skipped if not using the fiducial mark function.)
Fiducial mark recognition screen
64411-N3-00
5
Check that the Rolling dialog box appears.
After mark recognition is complete, the mark recognition screen automatically closes. The conveyor
table then moves to the printing position and is fixed, and the Rolling dialog box appears as shown
below.
Rolling dialog box
64312-N3-00
6
Check the squeegee print direction.
Use the [Squeegee Direction] button as needed to change the print direction according to the position
where solder was supplied.
7
Start rolling operation.
1. Press the [Stop after time over] button and enter the rolling time.
2. Press the [Start] button.
Rolling operation starts and will automatically stop when the time you set is reached.
n
NOTE
Check the scraped state of the solder on the mask during rolling operation, and if necessary, adjust the settings as in
the next step.
4-22
4
aily operation
8
Adjust the settings by checking the rolling state.
Press the [Stop] button in the Rolling dialog box to temporarily stop the rolling operation, and enter the
optimum values in the Squeegee Pressure and Squeegee Speed parameters.
n
NOTE
Set the Squeegee Speed and Squeegee Pressure parameters by checking how solder on the mask is scraped during
rolling operation. If the solder is not sufficiently scraped, increase the squeegee pressure and reduce the squeegee
speed. But, note that an excessive squeegee pressure level will cause the solder to spread beyond the required area
or will scrape away the solder too much.
9
Press the [Close] button when rolling operation is finished.
A dialog box for selecting auto cleaning appears after the rolling dialog box is closed.
0
Clean the mask by following the message on the screen.
Select the cleaning method (“Dry”, “Wet” or “Detail …1 to 4”) and press the [OK] button.
When you press the [OK] button after selecting any of “Detail …1 to 4”, cleaning will start according to
the conditions that are set on the [Controlled …1] to [Controlled …4] tabs of the “Cleaning Detail
Setting” screen. However, if the “Detail Auto interval” is set to “0”, the condition items are not displayed.
The cleaning unit starts moving to automatically clean the backside of the mask.
TIP
For information on the “Detail …1” to ”Detail …4” settings, see "6. Cleaner data setting" in Chapter 5.
[Automatic Cleaning] screen
64413-N3-00
TIP
If you want to perform manual cleaning, press the [Manual Cleaning] button and follow the message that appears.
q
Follow the message on the screen to unload the board.
4-23
4
aily operation
9. Starting board production
When solder rolling is finished, start production as follows.
1
Open the Setup screen and set the operating conditions.
Set the total number of boards to be produced and the operation speed.
Setup screen
Set the operation speed (%).
Set the total number of boards to be produced.
64414-N3-00
2
Start operation.
1. Release the emergency stop button, and press the [READY] button on the operation panel.
2. Check that the surrounding area is safe and then press the [START] button on the operation panel.
3. When the entrance sensor detects the board, the conveyor belt will start rotating. The board will
then be transferred to the printing position and solder printing will start.
w
WARNING


[START] button
Operation panel
63425-N3-00
TIP
When the "Cleaning Method" parameter (on the [Print]-[Cleaner] tab) is set to "Auto", the mask is automatically
cleaned every time that the specified number of boards has been produced (or at specified time intervals). To stop
production during automatic operation, press the [STOP] key on the operation panel. If you want to stop production
after printing and unloading the current board, press the [Convey-out Stop] button on the Setup screen. (See "10.
Finishing board production" in this chapter.)