YSP20_Users_E.pdf - 第92页
Chapter 4 Daily operation T his chapter explains typical operation for board production using the board data already created. Before reading this c hapter , make sure that you understand the basic procedures and key poin…
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Printing guide
4.4 Solder spread, solder bridge
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Backup jig (For backup pin)
If the backup pin positions are not appropriate or the number of pins is insufficient, the board is depressed by the
printing pressure, resulting in a gap between the board and mask.
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Alignment offset Z
The offset value in the Z direction (clearance between the board and mask) is too large.
Mask clearance
Solder
Board
Mask
Squeegee
Conveyor
Mask frame
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Cleaning interval
The printing is performed with the backside of the mask contaminated by solder since the cleaning interval is long.
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Cleaning repeat
The solder contamination on the backside of the mask cannot be wiped away completely with the set cleaning repeat
cycles.
4.5 Scraping trouble
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Squeegee pressure
The squeegee pressure is too low with respect to the squeegee speed and attack angle settings.
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Printing pressure
The printing pressure level is too low to the set squeegee speed and attack angle.
4.6 Solder enlargement
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Board separation speed
Both ends of the printed solder are enlarged since the board separation speed is slow.
4.7 Solder chipping, mask remaining
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Board separation speed
Since the board separation speed is too fast, the board is separated with the solder sticking to the mask.
Mask remaining
Solder
Board
Mask
Conveyor
Excessively high speed
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Board separation distance
The conveyor starts moving even though the board is not separated completely since the board separation distance is
short.
Chapter 4 Daily operation
This chapter explains typical operation for board production using the board data already created. Before reading this chapter,
make sure that you understand the basic procedures and key points explained in Chapter 2, "Basic operation".
To create new board data or edit the existing data, refer to Chapter 5, "Creating and setting the data".
Contents
1
2. Starting and warming up the machine 4-2
3. Selecting the board data 4-4
4. Changing the conveyor unit setup 4-5
5. Replacing the cleaning gauze roll 4-7
5.1 Using the same roll size 4-8
5.2 Changing the roll size 4-10
6. Refilling the cleaning solvent 4-12
6.1 Precautions when handling cleaning solvent 4-12
6.2 Refilling the cleaning solvent 4-12
6.3 Long-term storage tasks 4-14
7. Setting up the mask and squeegee 4-15
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9
8. Rolling operation 4-20
9. Starting board production 4-23
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4-1
4
aily operation
1. Overview
This chapter explains typical daily operation per the flow chart shown below.
Start machine
Check before operation
Warm-up operation
Change setups
Do you change board model?
Perform rolling operation
Finish production
Start production
Turn power off
Select board
Daily operation flow
NO
YES
Execute as needed.
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