00196457-05_UM_SX12DX12_SR706_EN.pdf - 第134页
3 Technical data and assemblies Us er Manual SIPLACE SX1/SX2/DX1/DX2 3.6 Placement head From software version SC.706.xx Version 06/2012 EN 134 3.6.3.1 Description This sophisticated placement head consists of tw o pla ce…
User Manual SIPLACE SX1/SX2/DX1/DX2 3 Technical data and assemblies
From software version SC.706.xx Version 06/2012 EN 3.6 Placement head
133
3.6.3 SIPLACE TwinStar for high precision IC placement
3
Fig. 3.6 - 9 SIPLACE TwinStar for high precision IC placement
3
(1) Pick&Place module 1 (P&P1) - the TwinStar consists of 2 Pick&Place modules
(2) Pick&Place module 2 (P&P2)
(3) DP axis
(4) Z axis drive
(5) Incremental distance measuring system for the Z axis
3 Technical data and assemblies User Manual SIPLACE SX1/SX2/DX1/DX2
3.6 Placement head From software version SC.706.xx Version 06/2012 EN
134
3.6.3.1 Description
This sophisticated placement head consists of two placement heads of the same type coupled to-
gether. Both heads work using the Pick&Place principle. The TwinStar is suitable for processing
complex and large components. Two components are picked up by the placement head, optically
centered on the way to the placement position and rotated into the necessary placement angle.
They are then placed gently and accurately onto the PCB with a controlled blast of air.
New nozzles (type 5xx) have been developed for the TwinStar. With an adapter you can also use
the nozzles of type 4xx from the Pick&Place head and nozzles of type 8xx and 9xx from the Col-
lect&Place heads.
User Manual SIPLACE SX1/SX2/DX1/DX2 3 Technical data and assemblies
From software version SC.706.xx Version 06/2012 EN 3.6 Placement head
135
3.6.3.2 Technical data
Optical centering with SIPLACE TwinStar
Fine-pitch camera
(component camera type
33)
SIPLACE TwinStar
Fine-pitch camera
(component camera type
36
a
)
SIPLACE TwinStar
Flip-Chip camera
(component camera type
25)
Component range
b
0402 to SO, PLCC, QFP,
BGA, special components,
bare dies, flip-chips
0603 to SO, PLCC, QFP,
BGA, special components,
bare dies, flip-chips
0201 to SO, PLCC, QFP,
sockets, plugs, BGA, spe-
cial components, bare dies,
flip-chips, shields
Component specs
c
max. height 25 mm 25 mm 25 mm
min. lead pitch 0.3 mm 0.4 mm 0.25 mm
min. lead width 0.15 mm 0.24 mm 0.1 mm
min. ball pitch 0.35 mm 0.56 mm 0.14 mm
min. ball diameter 0.2 mm 0.32 mm 0.08 mm
min. dimensions 1.0 mm x 0.5 mm 1.6 mm x 0.8 mm 0.6 mm x 0.3 mm
max. dimensions
Single measurement 55 mm x 45 mm 32 mm x 32 mm 16 mm x 16 mm
Multiple measurement -- -- 55 mm x 55 mm
For use with two nozzles: 50 mm x 50 mm or 69 mm x 10 mm --
For use with one nozzle: 78 mm x 78 mm or 110 mm x 10 mm
up to 200 mm x 110 mm (with restrictions)
--
max. weight
d
100 g 100 g 100 g
Programmable set-down
force
1.0 N - 15 N
2.0 N - 30 N
e
1.0 N - 15 N
2.0 N - 30 N
d
1.0 N - 15 N
2.0 N - 30 N
d
Nozzle types
f
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
gripper
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
gripper
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
gripper
Nozzle spacing for P&P heads 70.8 mm 70.8 mm 70.8 mm
X/Y accuracy
g
± 26 µm/3± 35 µm/4 ± 36 µm/3± 50 µm/4 ± 22 µm/3± 30 µm/4
Angular accuracy ± 0.05° / 3± 0.07°/ 4 ± 0.05° / 3± 0.07°/ 4 ± 0.05° / 3± 0.07° / 4
Illumination level 6 6 6
Possible illumination level
settings
256
6
256
6
256
6
a) For SIPLACE DX1/DX2 only
b) Please note that the placeable component range is also affected by the pad geometry, the customer-specific standards, the
component packaging tolerances and the component tolerances.
c) If the MultiStar and TwinStar are combined in the same placement area, the maximum component height may be restricted.
d) If standard nozzles are used
e) SIPLACE High-Force Head.
f) Over 300 different nozzles and 100 gripper types are available, with an extensive nozzle database available online.
g) The accuracy value, measured using the vendor-neutral IPC standard.