00196457-05_UM_SX12DX12_SR706_EN.pdf - 第138页
3 Technical data and assemblies Us er Manual SIPLACE SX1/SX2/DX1/DX2 3.6 Placement head From software version SC.706.xx Version 06/2012 EN 138 3.6.4.1 Description The 12 segment Collect&Place hea d operates according…
User Manual SIPLACE SX1/SX2/DX1/DX2 3 Technical data and assemblies
From software version SC.706.xx Version 06/2012 EN 3.6 Placement head
137
3
Fig. 3.6 - 11 12 segment Collect&Place head - function groups part 2
3
(1) Intermediate distributor board (under the cover)
(2) Star drive - DR motor
(3) Z axis motor
(4) Valve adjustment drive
(5) C&P component camera, type 28 (18 x 18) digital (standard camera)
or type 30 (18 x 18) digital, high-resolution
3 Technical data and assemblies User Manual SIPLACE SX1/SX2/DX1/DX2
3.6 Placement head From software version SC.706.xx Version 06/2012 EN
138
3.6.4.1 Description
The 12 segment Collect&Place head operates according to the Collect&Place principle i.e. one
cycle includes pickup of 12 components by the placement head, their optical centering on the way
to the placement position and their rotation into the required placement angle and position. They
are then placed gently and accurately onto the PCB with a blast of air. In contrast to the conven-
tional chip shooters, the twelve nozzles of the Collect&Place heads rotate around a horizontal
axis. This not only saves space: the reduced diameter leads to a lower formation of centrifugal
forces than in chip shooters. This largely prevents any unintentional displacement of components
during transportation.
Another benefit: the Collect&Place head has the same cycle time for all components. This means
that the placement performance no longer depends on the size of the components placed.
User Manual SIPLACE SX1/SX2/DX1/DX2 3 Technical data and assemblies
From software version SC.706.xx Version 06/2012 EN 3.6 Placement head
139
3.6.4.2 Technical data
3
Optical centering with 12 segment Collect&Place head
with component camera, type 28
12 segment Collect&Place head
with component camera, type 30
Component range
a
a) Please note that the component range that can be placed is also affected by the pad geometry, the custom-
er-specific standards and the packaging tolerances.
0402 to PLCC44, BGA, µBGA, Flip-
Chip, TSOP, QFP, SO to SO32,
DRAM
0201
b
to Flip-Chip, Bare Die,
PLCC44, BGA, µBGA, TSOP, QFP,
SO to SO32, DRAM
b) with 0201 package
Component specification
max. height
min. lead pitch
min. lead width
min. ball pitch
min. ball diameter
min. dimensions
max. dimensions
max. weight
6 mm
0.5 mm
0.2 mm
0.35 mm
0.2 mm
1.0 x 0.5 mm²
18.7 x 18.7 mm²
2 g
6 mm
0.3 mm
0.15 mm
0.25 mm
0.14 mm
0.6 x 0.3 mm²
18.7 x 18.7 mm²
2 g
Programmable
set-down force
2.5 N to 5.0 N
Nozzle types 3 xx 3xx
X/Y accuracy
c
c) The accuracy value was measured using the vendor-neutral IPC standard.
± 45 μm / 3, ± 60 μm / 4 ± 41 µm/3± 55 µm/4
Angular accuracy ± 0.5°/3, ± 0.7°/4 ± 0.5°/3, ± 0.7°/4
Component range 98% 98.5%
Component camera type 28 30
Illumination level 5 5
Possible illumination level
settings
256
5
256
5