SiplaceX4_en.pdf - 第52页
1 - 28 S tudent Guide SIPLACE X 2 Overview Edition 09/2005 28 2.2.9.2 Digit al Component Camera for 12-Segment C&P Head 2 Fig. 2.2 - 16 Component camera as standard on the 12-segment collect&place head 2 1. Compo…
1 - 27
Student Guide SIPLACE X
Edition 09/2005 2 Overview
27
2.2.9 Siplace Vision
The new, digital Siplace Vision system helps satisfy customer demands for greater speed, flexibil-
ity and robustness
Advantages of the digital Vision system:
– Robust and fast calculation algorithms
– Flexible measurement procedures
– Self-learning graphical user interface
– Supports geometrical description of components at the machine.
– State-of-the-art digital camera hardware
– Homogenous illumination of camera visual field and components
Each C&P head has its own digital component camera. For twin heads, a stationary camera is
installed in the machine.
2.2.9.1 Digital PCB Camera (Multicolor)
2
Fig. 2.2 - 15 PCB camera under the gantry (X-axis)
(1) Camera optics
(2) Camera amplifier
(3) Illumination control for blue, infrared and white LEDs in the various illumination levels
Technical data 2
2
PCB fiducials max. 3 per placement program
Field of view (FOV) 5.7 mm x 5.7 mm
Illumination type from above
Resolution 9.8µm/pixels
Fiducial size 0.3 to 2.5 mm (up to 3.0mm, depending on PCB trans-
port tolerance.)
Camera type .sst 24.sst
1 - 28
Student Guide SIPLACE X
2 Overview Edition 09/2005
28
2.2.9.2 Digital Component Camera for 12-Segment C&P Head
2
Fig. 2.2 - 16 Component camera as standard on the 12-segment collect&place head
2
1. Component camera optics and illumination
2. Camera amplifier
3. Illumination control
Technical data 2
2
Option: Digital camera from 6 segment DLM 2 head (camera type 29.sst) for 0201 placement. 2
Component size 0.5 mm x 0.5 mm to 18.7 mm x 18.7 mm
Component shape 0402 to PLCC44 incl. BGA, µBGA, Flip-Chip,
TSOP, QFP, PLCC, SO to SO32, DRAM
Minimum lead pitch 0.5 mm
Minimum ball pitch 0.45 mm
Minimum ball diameter 0.25 mm
Field of view (FOV) 24.5 mm x 24.5 mm
Illumination type from above (4 levels programmable)
Resolution 50µm/pixels
Camera type .sst 28.sst
1 - 29
Student Guide SIPLACE X
Edition 09/2005 2 Overview
29
2.2.9.3 Component Camera for 6-Segment C&P Head
2
Fig. 2.2 - 17 Component camera as standard on the 6-segment collect&place head
1. Component camera optics and illumination
2. Camera amplifier
3. Illumination control
Technical data 2
Component size 0.3 mm x 0.3 mm to 27 mm x 27 mm
Components 0201 to 27 mm x 27mm
PLCC, SO, QFP, TSDP, SOT, MELF, CHIP, IC BGA
Minimum lead pitch 0.3 mm
Minimum ball pitch
0.25 mm for BE < 18 x 18 mm
0.35 mm for BE ≥ 18 x 18 mm
Minimum ball diameter
0.14 mm for BE < 18 x 18 mm
0.2 mm for BE ≥ 18 x 18 mm
Field of view (FOV) 32 mm x 32 mm
Illumination type
from above (4 levels programmable)
Resolution 26µm/pixels
Camera type .sst 29.sst