SiplaceX4_en.pdf - 第55页

1 - 31 S tudent Guide SIPLACE X Edition 09/2005 2 Overview 31 2.2.9.5 St ationary IC Camera T echnical dat a 2 2 (1) Camera housing with integrated camera and camera amplifier (2) Within the 6 illumina tion and optics le…

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Student Guide SIPLACE X
2 Overview Edition 09/2005
30
2.2.9.4 Component Camera for 20-Segment C&P Head
2
Fig. 2.2 - 18 Component camera as standard on the 20-segment collect&place head
(1) Component camera optics and illumination
(2) Camera amplifier
(3) Illumination control
Technical data 2
2
2
Component size 0.2 mm x 0.2 mm to 6 mm x 6 mm
Components 01005 to 2220 (Flip CHIP, Bare Dies)
Minimum pitch leads 0.5 mm
Minimum ball pitch
0.45 mm
Minimum ball diameter
0.25 mm
Field of view (FOV) 8 mm x 8 mm
Illumination type from above (5 levels programmable)
Resolution 14.1 µm/pixels
Camera type .sst 23.sst
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Student Guide SIPLACE X
Edition 09/2005 2 Overview
31
2.2.9.5 Stationary IC Camera
Technical data 2
2
(1) Camera housing with integrated camera and
camera amplifier
(2) Within the 6 illumination and optics levels
Component size 0.5mm x 0.5mm to 55 mm x 45 mm in single measurement mode
Components 0402, MELF, SO, PLCC, QFP, electrolytic capacitor, BGA
Minimum lead pitch 0.3 mm
Minimum ball pitch 0.45 mm
Minimum ball diameter 0.25 mm
Field of view (FOV) 65 mm x 50 mm
Illumination type from above (6 levels programmable)
Resolution 41µm/pixels
Camera type .sst 33.sst
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Student Guide SIPLACE X
2 Overview Edition 09/2005
32
2.2.9.6 Flip - Chip (FC) Camera (Optional)
The flip chip camera or FC camera has greater resolution and is therefore ideal for all remaining
components in the SMD component spectrum.The structure of the FC camera is identical with that
of the IC camera, with its 6 illumination levels.
Fig. 2.2 - 19 FC camera
Technical data 2
2
(1) Camera housing with integrated camera and
camera amplifier
(2) Within the 6 illumination and optics levels
Component size 0.2mm x 0.2mm to 16 mm x 16 mm in single measurement mode
Components 01005, Flip Chip,µBGA, Bare Die‘s
Minimum lead pitch 0.25 mm
Minimum ball pitch 0.14 mm
Minimum ball diameter 0.08 mm
Field of view (FOV) 19 mm x 19 mm
Illumination type from above (6 levels programmable)
Resolution 16µm/pixels
Camera type .sst 25.sst