SiplaceX4_en.pdf - 第547页
1 - 4 S tudent Guide SIPLACE X 12 Siplace X - Head M odularity Edition 09/2005 4 12.1.1 Production requirement s Please Note: The reconfiguration of the Sip lac e X machine should exist for a longe r production time of a…
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Student Guide SIPLACE X
Edition 09/2005 12 Siplace X - Head Modularity
3
12 Siplace X - Head Modularity
12.1 Head Modularity
A very useful feature in the SIPLACE family is its Head Modularity HM. A simple handling to
change the head, the machine can be fit to the current production requirements. For the SIPLACE
X machine, we have the following possibilities of the head configuration:
Fig. 12.1 - 1 Head modularity Siplace X
PA1 PA2
X2
Gantry3
TH
6 / 12 /C&P20/
TH
Gantry1
X2
Gantry3
6
6 / 12 / C&P20
Gantry1
X2
Gantry3
12
12 / C&P20
Gantry1
X3 6 / 12
Gantry4 Gantry3
TH / 6
6 / 12
Gantry1
X3 C&P 20
Gantry4 Gantry3
TH / 6 / 12
C&P 20
Gantry1
X4 6 / 12
Gantry4 Gantry3
6
6 / 12
Gantry1 Gantry2
6
X4 C&P 20
Gantry4 Gantry3
6 / 12
C&P 20
Gantry1 Gantry2
6 / 12
X4 C&P 20
Gantry4 Gantry3
6 / 12 / C&P20
C&P 20
Gantry1 Gantry2
6 / 12 / C&P20
PA1 Placement Area1 PA2 Placement Area2
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Student Guide SIPLACE X
12 Siplace X - Head Modularity Edition 09/2005
4
12.1.1 Production requirements
Please Note:
The reconfiguration of the Siplace X machine should exist for a longer production time of a product
and not occur by the week because the configuration and the calibration of the machine, depend
of the machine type and the number of heads, uses approximately one day. 12
Which decisions must be taken before head exchange?
Fig. 12.1 - 2 Means of deciding between C&P head and Twin head
Please Note:
In the case of a PCB with different component sizes, you should decide for which C&P head install
the 12 segment C&P head or 6 segment C&P head with ir without DCA camera
(see Fig. 12.1 - 3) or the 20 segment C&P head. 12
Only IC`s respective Odd
shape placement?
Mixed fast IC`s respective
Odd shape placement?
Only fast chip`s and IC`s
placement?
X2: Gantry 1 / 3 -->Twin head
X3: Gantry 1 / 4 -->6 Segment C&P head
Gantry 3 -->Twin head
X2: Gantry 1 --> 12 Segment C&P head
Gantry 3 --> Twin head
X3: Gantry 1/4 --> 2x12 or 2x20 Segment
C&P head
Gantry 3 --> 6 Segment C&P head
X4: Gantry 1 / 4 Æ 20 Segment C&P head
Gantry 2 / 3 Æ 6/12 Segment C&P head
X2: Gantry 1 -->C&P head
Gantry 3 -->Twin head
X3: Gantry 1 -->12 Segment C&P head
Gantry 4 -->6 Segment C&P head
Gantry 3 -->Twin head
Yes
Yes
Yes
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Student Guide SIPLACE X
Edition 09/2005 12 Siplace X - Head Modularity
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Fig. 12.1 - 3 Means of deciding between 12 segment C&P head or 6 segment C&P head w/o DCA camera
Please Note:
For the Option Head Modularity please use the retrofitting instruction "Head Reconfiguration kits
00119721- Twin Head Reconfiguration Kit X-Serie
00119760- 12-Seg. C&P Head Reconfiguration Kit digital
00119761- 6-Seg. C&P Head Reconfiguration Kit digital
00119762- C&P20 Head Reconfiguration Kit
On the 6 segment C&P head is a high resolution camera as standard mounted, so you can use
this camera on the 12 segment C&P head for 0201 components and Flip chip‘s.
Component size > 18,7x18,7mm
Component height > 6mm
?
BE weight > 2g?
0201 or BARE DIE
Flip chip placement?
6 segment C&P head
6 segment C&P head with standard
Camera or
12 segment C&P head with the
camera from the 6 C&P head (DCA)
6 segment C&P head
Yes
Yes
Yes
12 Segment C&P head
No
No
No
12 Segment C&P head with
standard camera
Deciding factors about the choice of the C & P heads and the camera types.