00195741-0102_UM_D1_D2_SR605_EN.pdf - 第169页
User Manual SIPLACE D1/D2 3 Technical data for the machine From software version SR.605.xx 07/2008 EN Edition 3.10 Feeder modules 169 The Dip module is suit able for all the placement he ads. It is regarded as a separate…
3 Technical data for the machine User Manual SIPLACE D1/D2
3.10 Feeder modules From software version SR.605.xx 07/2008 EN Edition
168
3.10.9.5 Data entry
Define the waffle-pack trays as described in the SIPLACE Pro operating instructions.
3.10.10 Dip module
Item no. 00117010-xx Dip module for flux and adhesives
3
Fig. 3.10 - 19 Dip module
(1) Dip module
(2) Rotating plate
(3) Squeegee
3.10.10.1 Description
The dip module (item 1 in Fig. 3.10 - 19) is used to wet flip-chip and CSP components with flux or
conductive adhesive. The flux holder is a rotating plate (item 2 in Fig. 3.10 - 19
), on which a thin
film of flux (e.g. 40 μm) is created with a squeegee (item 3 in Fig. 3.10 - 19
). This method is par-
ticularly suitable for highly viscous (honey-like) fluxes. The amount of flux required for the process
is reduced to a minimum coating thickness since only the undersides of the bumps have to be wet-
ted.
User Manual SIPLACE D1/D2 3 Technical data for the machine
From software version SR.605.xx 07/2008 EN Edition 3.10 Feeder modules
169
The Dip module is suitable for all the placement heads. It is regarded as a separate feeder module
type by the set-up optimization. There is no limit to the number of dip modules at the individual
locations.
3.10.10.2 Technical data
Locations filled 3 3
Component size Max. 36 x 36 mm²
depending on the placement head type 3
Possible coating thicknesses 25, 35, 45, 55, 65, 75 μm 3
Time required to change the coating thickness Less than 1 min. 3
Gap height tolerance ± 5 μm 3
Time for 1 revolution of the table Can be set using the potentiometer
from 0 - 10 s 3
Component dip time Programmable from 0 - 2 s
in 0.1 s increments 3
Flux Highly viscous flux, conductive adhesive 3
Further technical data and information on programming can be found in the Betriebsanleitung
DIP-Modul / DIP Module User Manual, item no. 00195065-xx.
3
3 Technical data for the machine User Manual SIPLACE D1/D2
3.11 Component trolley From software version SR.605.xx 07/2008 EN Edition
170
3.11 Component trolley
Item no. 00119822-xx Component trolley SIPLACE D1/D2
One or two component trolleys can be docked into the machines. The locations are numbered as
shown in the diagram below.
3
Fig. 3.11 - 1 Locations for the component trolleys
(1) Location 1
(2) Location 3
(T) PCB direction of travel
The component trolleys are stand-alone modules that can be set up with feeders at an external
set-up area. This means that the production process only has to be interrupted briefly in order to
change the component trolley.