00195741-0102_UM_D1_D2_SR605_EN.pdf - 第96页
2 Operational safety User Manual SIPLACE D1/D2 2.11 ESD guidelines From software version SR.605.xx 07/2008 EN Edition 96 Always place the modules on a conductive surfac e ( table with an ESD coating, cond uctive ESD foam…
User Manual SIPLACE D1/D2 2 Operational safety
From software version SR.605.xx 07/2008 EN Edition 2.11 ESD guidelines
95
2.11 ESD guidelines
2.11.1 What does ESD mean?
Almost all of the modules in use today are equipped with highly integrated MOS blocks and com-
ponents. The manufacturing techniques used mean that these electronic components are ex-
tremely sensitive to overvoltage and thus to electrostatic discharge.
The abbreviation for such modules is 'ESD' (Electrostatic Sensitive Device). ’ESD’ is used inter-
nationally. The following symbol on cabinet rating plates, racks or packaging indicates that com-
ponents which are sensitive to electrostatic discharge have been used and thus that the modules
concerned are also touch-sensitive.
ESDs can be destroyed by voltages and power levels that are far below the level
that can be perceived by humans. Such voltages occur if a person touches a com-
ponent or module without earthing themselves. Components that are exposed to
such overvoltages do not generally appear to be defective immediately - incorrect
behavior starts after the component or module has been in operation for some time.
2.11.2 Important measures to protect against static charging
→ Most plastics can easily become charged and must therefore be kept away from at-risk com-
ponents.
→ Always ensure that people, the workplace and packaging are safely earthed when handling
electrostatic sensitive components.
2.11.3 Handling ESD modules
Do not touch electronic modules unless it is absolutely essential to do so in order to carry out other
work. If it is necessary, make sure that you do not touch the pins or printed conductors when you
pick up flat modules.
Do not touch components unless
→ you are constantly earthed by an ESD wrist strap or
→ you are wearing ESD shoes or ESD shoe earthing strips on an ESD floor.
Always discharge yourself before you touch an electronic module. To do this, simply touch a con-
ductive and earthed object immediately before you touch the module (such as unpainted parts of
a switch cabinet, a water pipe, etc.).
Do not allow modules with chargeable and highly insulating materials to touch one another, e.g.
plastic films, insulating table surfaces or items of clothing made from synthetic fibers.
2 Operational safety User Manual SIPLACE D1/D2
2.11 ESD guidelines From software version SR.605.xx 07/2008 EN Edition
96
Always place the modules on a conductive surface (table with an ESD coating, conductive ESD
foam, ESD bag or container).
Do not bring modules near visual display units, monitors or televisions. Keep them at least 10 cm
away from the screen.
2.11.4 Measurements and modifications to ESD modules
Do not take measurements on the modules unless the following conditions are fulfilled:
– the measuring device is earthed (e.g. via PE conductors) or
– you discharge the measuring head just before taking measurements with a potential-free
measuring device (e.g. by touching an unpainted metal part of the controller casing).
→ Always use an earthed soldering iron if you carry out any soldering work.
2.11.5 Dispatching ESD modules
→ Always store modules and components in conductive packaging (e.g. metallized plastic bags
or metal sleeves) and dispatch them in conductive packaging.
If the packaging is not conductive, place the modules in a conductive envelope before pack-
aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex-
ample. NEVER use plastic bags or film. 2
→ If the module has integral batteries, ensure that the conductive packaging does not touch or
short-circuit the battery terminals and, if necessary, first cover the terminals with insulating
tape or material.
User Manual SIPLACE D1/D2 3 Technical data for the machine
From software version SR.605.xx 07/2008 EN Edition 3.1 Performance data for the SIPLACE D1 machine
97
3 Technical data for the machine
3.1 Performance data for the SIPLACE D1 machine
3
Types of placement
head
12-segment Collect&Place head (C&P12)
6-segment Collect&Place head (C&P6)
Pick&Place head (P&P)
PLEASE NOTE IPC value [comp./h]
According to the vendor-neutral conditions of the IPC 9850 standard
published by the Association of Connecting Electronics Industries.
SIPLACE Benchmark value [comp./h]
The SIPLACE benchmark value is measured during the machine
acceptance tests. It corresponds to the conditions set out in the
SIPLACE scope of service and supply.
Theoretical maximum output value [comp./h]
The theoretical maximum output value is calculated from the most
favorable conditions for each machine type and setting, and corre-
sponds to the theoretical conditions normally used in the industry.
Number of gantries
1
IPC value Benchmark value Theoretical value
Placement head con-
figuration and place-
ment head rate
[comp./h]
C&P12
C&P6
P&P
13,000
8,400
2,600
15,000
9,800
2,800
20,000
11,500
3,500
Range of components 0.4 x 0.2 mm² (01005)
a
; 0.6 x 0.3 mm² (0201)
b
to 85 x 85 mm², max. 200 x 125 mm² (with restrictions)
Component height C&P12: 6 mm
C&P6: 8.5 mm
P&P: 19 mm
Placement accuracy C&P12: CO camera type 28 (18x18): ± 50 μm (3σ), ± 67 μm (4σ)
CO camera type 29 (27x27): ± 50 μm (3σ), ± 67 μm (4σ)
CO camera type 38 (16x16): ± 50 μm (3σ), ± 67 μm (4σ)
C&P6: CO camera type 29 (27x27): ± 52.5 μm (3σ), ± 70 μm (4σ)
P&P: CO camera type 36 (32x32): ± 37.5 μm (3σ), ± 50 μm (4σ)
P&P: CO camera type 25 (16x16): ± 30 μm (3σ), ± 40 μm (4σ)
P&P: CO camera type 33 (55x45): ± 37.5 μm (3σ), ± 50 μm (4σ)