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User Manual SIPLACE D1/D2 3 Technical data for the machine From software version SR.605.xx 07/2008 EN Edition 3.1 Performance data for the SIPLACE D1 machine 97 3 T echnical dat a for the machine 3.1 Performance dat a fo…

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2 Operational safety User Manual SIPLACE D1/D2
2.11 ESD guidelines From software version SR.605.xx 07/2008 EN Edition
96
Always place the modules on a conductive surface (table with an ESD coating, conductive ESD
foam, ESD bag or container).
Do not bring modules near visual display units, monitors or televisions. Keep them at least 10 cm
away from the screen.
2.11.4 Measurements and modifications to ESD modules
Do not take measurements on the modules unless the following conditions are fulfilled:
– the measuring device is earthed (e.g. via PE conductors) or
– you discharge the measuring head just before taking measurements with a potential-free
measuring device (e.g. by touching an unpainted metal part of the controller casing).
→ Always use an earthed soldering iron if you carry out any soldering work.
2.11.5 Dispatching ESD modules
→ Always store modules and components in conductive packaging (e.g. metallized plastic bags
or metal sleeves) and dispatch them in conductive packaging.
If the packaging is not conductive, place the modules in a conductive envelope before pack-
aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex-
ample. NEVER use plastic bags or film. 2
→ If the module has integral batteries, ensure that the conductive packaging does not touch or
short-circuit the battery terminals and, if necessary, first cover the terminals with insulating
tape or material.
User Manual SIPLACE D1/D2 3 Technical data for the machine
From software version SR.605.xx 07/2008 EN Edition 3.1 Performance data for the SIPLACE D1 machine
97
3 Technical data for the machine
3.1 Performance data for the SIPLACE D1 machine
3
Types of placement
head
12-segment Collect&Place head (C&P12)
6-segment Collect&Place head (C&P6)
Pick&Place head (P&P)
PLEASE NOTE IPC value [comp./h]
According to the vendor-neutral conditions of the IPC 9850 standard
published by the Association of Connecting Electronics Industries.
SIPLACE Benchmark value [comp./h]
The SIPLACE benchmark value is measured during the machine
acceptance tests. It corresponds to the conditions set out in the
SIPLACE scope of service and supply.
Theoretical maximum output value [comp./h]
The theoretical maximum output value is calculated from the most
favorable conditions for each machine type and setting, and corre-
sponds to the theoretical conditions normally used in the industry.
Number of gantries
1
IPC value Benchmark value Theoretical value
Placement head con-
figuration and place-
ment head rate
[comp./h]
C&P12
C&P6
P&P
13,000
8,400
2,600
15,000
9,800
2,800
20,000
11,500
3,500
Range of components 0.4 x 0.2 mm² (01005)
a
; 0.6 x 0.3 mm² (0201)
b
to 85 x 85 mm², max. 200 x 125 mm² (with restrictions)
Component height C&P12: 6 mm
C&P6: 8.5 mm
P&P: 19 mm
Placement accuracy C&P12: CO camera type 28 (18x18): ± 50 μm (3σ), ± 67 μm (4σ)
CO camera type 29 (27x27): ± 50 μm (3σ), ± 67 μm (4σ)
CO camera type 38 (16x16): ± 50 μm (3σ), ± 67 μm (4σ)
C&P6: CO camera type 29 (27x27): ± 52.5 μm (3σ), ± 70 μm (4σ)
P&P: CO camera type 36 (32x32): ± 37.5 μm (3σ), ± 50 μm (4σ)
P&P: CO camera type 25 (16x16): ± 30 μm (3σ), ± 40 μm (4σ)
P&P: CO camera type 33 (55x45): ± 37.5 μm (3σ), ± 50 μm (4σ)
3 Technical data for the machine User Manual SIPLACE D1/D2
3.1 Performance data for the SIPLACE D1 machine From software version SR.605.xx 07/2008 EN Edition
98
Angular accuracy C&P12: CO camera type 28 (18x18): ± 0.53° (3σ), ± 0.71° (4σ)
CO camera type 29 (27x27): ± 0.53° (3σ), ± 0.71° (4σ)
CO camera type 38 (16x16): ± 0.53° (3σ), ± 0.71° (4σ)
C&P6: CO camera type 29 (27x27): ± 0.225° (3σ), ± 0.3° (4σ)
P&P: CO camera type 36 (32x32): ± 0.053° (3σ), ± 0.071° (4σ)
P&P: CO camera type 25 (16x16): ± 0.053° (3σ), ± 0.071° (4σ)
P&P: CO camera type 33 (55x45): ± 0.053° (3σ), ± 0.071° (4σ)
Component feeding 2 component trolleys with tape reel containers and integrated waste
container (15 locations each 30 mm wide per component trolley or 1
waffle-pack changer in place of a component trolley at location 1,
additional 5 locations for 30 mm wide feeder modules)
Feeder module types Tapes, bulk cases, stick magazines, application-specific OEM feeder
modules, surftape feeder modules (8, 12, 16 mm), waffle-pack tray at
location 1
Feeding capacity 30 tape feeder modules 3 x 8 mm S (90 tracks)
30 tape feeder modules 2 x 8 mm S (60 tracks)
30 tape feeder modules 12/16 mm S (30 tracks)
20 tape feeder modules 24/32 mm S (20 tracks)
14 tape feeder modules 44 mm S (14 tracks)
12 tape feeder modules 56 mm S (12 tracks)
10 tape feeder modules 72 mm S (10 tracks)
8 tape feeder modules 88 mm S (8 tracks)
PCB format
(LxW)
Single conveyor
50 x 50 mm² to 460 x 460 mm²
50 x 80 mm² to 610 x 460 mm² (Long board option)
Width up to 508 mm for Wide board configuration
Dual conveyor
50 x 50 mm² to 460 x 216 mm²
50 x 80 mm² to 610 x 216 mm² (Long board option)
Width up to 242 mm for Wide board configuration
Dual conveyor in Single conveyor mode
50 x 50 mm² to 460 x 380 mm²
50 x 80 mm² to 610 x 380 mm² (Long board option)
Width up to 430 mm for Wide board configuration
PCB thickness 0.3 to 4.5 mm (thicker PCBs available on request)
a) With 01005 package
b) With 0201 package