00197498-03_UM_SiplaceCA-Serie_EN.pdf - 第122页

3 Technical Data User Manual SIPLACE CA-Series 3.1 Performance Data for the SIPLACE CA From software version SC.708.0 Edition 12/2014 EN -DRAFT 122 3.1.1 Maximum V alues Pickup on SWS Pickup on X- ta b l e Flip Chip Die …

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User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.1 Performance Data for the SIPLACE CA
121
3 Technical Data
3.1 Performance Data for the SIPLACE CA
3
PLEASE NOTE
Benchmark values
The following table lists the benchmark values (as defined in the "Scope of Service and
Delivery SIPLACE CA") for SMT placement per placement area.
Placement head types
SIPLACE SpeedStar (C&P20 M)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
Placement performance
The placement performance is affected by the different head combinations and positions, plus the conveyor
configuration. Individual options and customized applications also influence the placement performance.
On request, SIPLACE can calculate the actual performance of your product on your machine configuration.
SIPLACE benchmark value [components/h]
The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the
conditions set out in the SIPLACE scope of service and supply.
SIPLACE CA4 placement machine
*a
See the note above for definition of placement performance values.
Number of gantries 4
Placement area 1 Placement area 2 Benchmark value Option
C&P20 M / C&P20 M C&P20 M / C&P20 M 80,000
Without High Precision Flag
C&P20 M / C&P20 M C&P20 M / C&P20 M 64,000 With High Precision Flag
C&P20 M / C&P20 M CPP_H / CPP_H 76,000 Without High Precision Flag
C&P20 M / C&P20 M CPP_H / CPP_H 67,000 With High Precision Flag on
C&P20 M
CPP_H / CPP_H CPP_H / CPP_H 72,000 --
C&P20 M / C&P20 M CPP_H/TH 63,000
Without High Precision Flag
C&P20 M / C&P20 M CPP_H/TH 54,000 With High Precision Flag on
C&P20 M
CPP_H / CPP_H CPP_H/TH 59,000 --
*)a Values only valid in conjunction with 4 X tables
CPP_H = MultiStar CPP only in high assembly position
3 Technical Data User Manual SIPLACE CA-Series
3.1 Performance Data for the SIPLACE CA From software version SC.708.0 Edition 12/2014 EN -DRAFT
122
3.1.1 Maximum Values
Pickup on SWS Pickup on X-
table
Flip Chip Die Attach SMD
Accuracy
*a
C&P20 M
CPP
TH
± 10 µm at 3σ
± 25 µm at 3σ
--
± 10 µm at 3σ
± 25µm at 3σ
--
± 20 µm at 3σ
± 25 µm at 3σ
± 22 µm at 3σ
*b
Placement performance
*c
4 SWS, without dipping 4 SWS SMD
C&P20 M
CPP
TH
42,000 die/h
42,000 die/h
--
28,000 die/h
26,000 die/h
--
See page 121
Die / component size
Flip Chip Die Attach SMD
C&P20 M
CPP
TH
0.5 x 0.5 mm
*d
*e
to 6 x 6 mm
0.5 x 0.5 mm
d e
to 27 x 27 mm
--
0.8 x 0.8 mm
d
to 6 x 6 mm
0.8 x 0.8 mm
d
to 27 x 27 mm
--
See page 151
See page 161
See page 164
Feeder module
types
Tape feeder module, waffle pack tray, stick magazine
feeders, bulk case, dip module, application-specific
OEM feeder modules, SIPLACE Wafer Feeder (SWS)
Supply capacity
(Component trolley
SIPLACE X)
160 tape feeder modules 8 mm X
Substrate size 50 mm x 50 mm to 535 mm x 850 mm
*f
Substrate thickness 0.3 mm to 4.5 mm
*)a 10µm at 3σ in placement process with the "Embedded Wafer Level Ballgrid Array" option (on request).
*)b With stationary camera, type 25
*)c The placement performance depends on several project-specific parameters. The ex-
pected throughput can be individually calculated on request.
*)d Smaller dies on request
*)e Dipping: depends on process
*)f 850 mm on request
User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.1 Performance Data for the SIPLACE CA
123
3.1.2 Technical Data - SWS
3
Technical Data Flip Chip Die Attach
Minimum die thickness (silicium) - without com-
ponent sensor
50 µm 50 µm
Minimum die thickness (silicium) - with compo-
nent sensor
100 µm 100 µm
Minimum bump size 50 µm n/a
Minimum bump grid 100 µm n/a
SIPLACE Wafer System SWS Horizontal system, automatic wafer change, MCM
SWS wafer size 4" to 12"
4" / 6" with adapter on request
Wafer frame 12"/8"
6" on request
4" with adapter
Hoop /grip ring thickness Max. 3.5 mm
Wafer magazine
*a
Up to 12"
Die Ejection System Programmable ejection speed (synchronous and asynchronous)
Option: Linear Dipping Unit LDU Individually programmable speed
Flux viscosity 3,000 to 100,000 cPs
Accuracy of flux height ± 5 µm
*)a Depending on the wafer magazine, you may need to mechanically adjust the base plate for the wafer magazines.