00197498-03_UM_SiplaceCA-Serie_EN.pdf - 第164页

3 Technical Data User Manual SIPLACE CA-Series 3.7 Placement Heads From software version SC.708.0 Edition 12/2014 EN -DR AFT 164 3.7.3.2 T echnical Dat a SIPLACE T winStar *a With component camera type 33 (fine pitch cam…

100%1 / 518
User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.7 Placement Heads
163
3.7.3.1 Description
This sophisticated placement head consists of two placement heads of the same type coupled to-
gether ("twin" head). Both heads work using the Pick&Place principle. The TwinStar is suitable for
processing complex and large components. Two components are picked up by the placement
head, optically centered on the way to the placement position and rotated into the necessary
placement angle. They are then placed gently and accurately onto the PCB with a controlled blast
of air.
New nozzles (type 5xx) have been developed for the TwinStar. With an adapter you can also use
the nozzles of type 4xx from the Pick&Place head and nozzles of type 8xx and 9xx from the Col-
lect&Place heads.
3 Technical Data User Manual SIPLACE CA-Series
3.7 Placement Heads From software version SC.708.0 Edition 12/2014 EN -DRAFT
164
3.7.3.2 Technical Data
SIPLACE TwinStar
*a
With component camera type 33
(fine pitch camera)
With component camera type 25
(flip chip camera)
Component range
*b
0402 to SO, PLCC, QFP, BGA, special compo-
nents, bare dies, flip-chips
0201 to SO, PLCC, QFP, sockets,
plugs, BGA, special components, bare
dies, flip-chips, shields
Component specs
*c
Max. height
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
*d
25 mm (higher available on request)
0.3 mm
0.15 mm
0.35 mm
0.2 mm
1.0 mm x 0.5 mm
55 mm x 45 mm (single measurement)
For use with two nozzles (multiple measurement)
50 mm x 50 mm or
69 mm x 10 mm
For use with one nozzle
85 mm x 85 mm or
125 mm x 10 mm
up to 200 mm x 125 mm (with restrictions)
100 g
25 mm (higher available on request)
0.25 mm
0.1 mm
0.14 mm
0.08 mm
0.6mm x 0.3mm
16 mm x 16 mm (single measurement)
55 mm x 55 mm (multiple measure-
ment)
100 g
Programmable set-down
force
1.0 N - 15 N
2.0 N - 30 N
*e
1.0 N - 15 N
2.0 N - 30 N
d
Nozzle types
*f
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
Gripper
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
Gripper
Nozzle spacing for P&P
heads
70.8 mm 70.8 mm
X/Y accuracy
*g
± 26 µm / 3σ, ± 35 µm / 4σ ± 22 µm / 3σ, ± 30 µm / 4σ
Angular accuracy ± 0.05° / 3σ, ± 0.07°/ 4σ ± 0.05° / 3σ, ± 0.07° / 4σ
Illumination level 6 6
Possible illumination level
settings
256
6
256
6
*)a Not in conjunction with SWS and not on location 2/4.
*)b Please note that the placeable component range is also affected by the pad geometry, the customer-specific standards, the com-
ponent packaging tolerances and the component tolerances.
*)c If the MultiStar and TwinStar are combined in the same placement area, the maximum component height may be restricted .
*)d If standard nozzles are used
*)e SIPLACE High-Force Head.
*)f Over 300 different nozzles and 100 gripper types are available, with an extensive nozzle database available online.
*)g The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the conditions set out in the
SIPLACE scope of service and supply.
User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.8 Electrical and Pneumatic Connections
165
3.8 Electrical and Pneumatic Connections
3.8.1 Electrical Connection (Placement Machine)
3
Fig. 3.8 - 1 Electrical connection on the placement machine
(1) Main switch
(2) Cover above the power supply unit
(3) Power supply unit
(4) Angled cable gland
(5) Mains connection cable
(T) Direction of PCB transport