00197498-03_UM_SiplaceCA-Serie_EN.pdf - 第124页
3 Technical Data User Manual SIPLACE CA-Series 3.1 Performance Data for the SIPLACE CA From software version SC.708.0 Edition 12/2014 EN -DRAFT 124 3.1.3 T echnical Data - SMT 3 Placement head types SIPLACE SpeedStar (C&…
User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.1 Performance Data for the SIPLACE CA
123
3.1.2 Technical Data - SWS
3
Technical Data Flip Chip Die Attach
Minimum die thickness (silicium) - without com-
ponent sensor
50 µm 50 µm
Minimum die thickness (silicium) - with compo-
nent sensor
100 µm 100 µm
Minimum bump size 50 µm n/a
Minimum bump grid 100 µm n/a
SIPLACE Wafer System SWS Horizontal system, automatic wafer change, MCM
SWS wafer size 4" to 12"
4" / 6" with adapter on request
Wafer frame 12"/8"
6" on request
4" with adapter
Hoop /grip ring thickness Max. 3.5 mm
Wafer magazine
*a
Up to 12"
Die Ejection System Programmable ejection speed (synchronous and asynchronous)
Option: Linear Dipping Unit LDU Individually programmable speed
Flux viscosity 3,000 to 100,000 cPs
Accuracy of flux height ± 5 µm
*)a Depending on the wafer magazine, you may need to mechanically adjust the base plate for the wafer magazines.
3 Technical Data User Manual SIPLACE CA-Series
3.1 Performance Data for the SIPLACE CA From software version SC.708.0 Edition 12/2014 EN -DRAFT
124
3.1.3 Technical Data - SMT
3
Placement head types SIPLACE SpeedStar (C&P20 M)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
Number of gantries CA4: 4 gantries
Component range 0.4 x 0.2 mm² (01005), 0.6 x 0.3 mm² (0201)
to 85 x 85 mm² / 125 x 10 mm²,
Max. 200 x 125 mm² (with restrictions)
Component height C&P20 M
CPP
TH
4 mm
6 mm / 8.5 mm / 11.5 mm
25 mm (greater height on request)
Placement accuracy
(Standard-criteria for
SMD)
C&P20 M
CPP
CPP
TH
TH
± 20 µm (3σ)
± 41 µm (3σ)
± 34 µm (3σ)
± 26 µm (3σ)
± 22 µm (3σ)
Component camera, type 41
Component camera, type 30
Component camera, type 33
Component camera, type 33
Component camera, type 25
Placement accuracy
(Advanced criteria for
SWS)
C&P20 M
CPP
TH
± 10 µm (3σ)
± 41 µm (3σ)
± 26 µm (3σ)
Component camera, type 41
Component camera, type 30
Component camera, type 33
Angular accuracy C&P20 M
CPP
*a
CPP
*b
CPP
TH
TH
± 0.2° (3σ)
± 0.4° (3σ)
± 0.5° (3σ)
± 0.2° (3σ)
± 0.05° (3σ)
± 0.05° (3σ)
Component camera, type 41
Component camera, type 30
Component camera, type 30
Component camera, type 33
Component camera, type 33
Component camera, type 25
*)a Component dimensions between 6 mm x 6 mm and 27 mm x 27 mm.
*)b Component dimensions smaller than 6 mm x 6 mm.
User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.2 Component Feeding
125
3.2 Component Feeding
3
Component feed-
ing
– SIPLACE CA4: Up to four SWS possible in placement area 1 and 2
– Component trolley (X-Series)
(with tape reel mount and integrated waste tape bin,
40 locations a 8 mm X-feeder module per component trolley)
– Matrix Tray Changer (on request)
Feeder module
types
– X-Series component trolley> Tapes, waffle pack trays
Supply capacity
(Component trol-
ley
X-Series)
160 tracks Width: 10.8 mm 4 mm X feeder modules
160 tracks Width: 10.8 mm 8 mm X feeder modules
160 tracks Width: 22.9 mm Smart Feeder 2x8 mm X
80 tracks Width: 22.6 mm Smart Feeder 12 mm X
52 tracks Width: 22.6 mm Smart Feeder 16 mm X
52 tracks Width: 34.4 mm 24 mm X feeder modules
40 tracks Width: 46.2 mm 32 mm X feeder modules
32 tracks Width: 58.0 mm 44 mm X feeder modules
24 tracks Width: 69.8 mm 56 mm X feeder modules
20 tracks Width 81.6 mm 72 mm X feeder modules
16 tracks Width: 105.2 mm 88 mm X feeder modules