00197498-03_UM_SiplaceCA-Serie_EN.pdf - 第210页
4 SIPLACE Wafer System (SWS) User Manual SIPLACE CA- Series 4.1 Functions From software version SC.708.0 Edition 12/2014 210 4.1.5.4 Flip Chip Encoded Positions (Af ter Calibration) 4 4 Fig. 4.1 - 9 Flip Chip Encoded Pos…
User Manual SIPLACE CA-Series 4 SIPLACE Wafer System (SWS)
From software version SC.708.0 Edition 12/2014 4.1 Functions
209
4.1.5.3 Die Attach - Transfer Position
4
Fig. 4.1 - 8 Die Attach - Transfer Position
(1) The die attach rotates to the transfer position.
(2) The SIPLACE head picks the chip up from the die attach segment and rotates to the next star
position.
(3) At the same time the X axis retracts the segment no. 1 back into the home position.
(4) The flip chip unit - segment no. 1 rotates to the transfer position and picks up the next chip.
4
PLEASE NOTE
While using the die attach unit only the segment no.1 of the flip chip unit is active.
4 SIPLACE Wafer System (SWS) User Manual SIPLACE CA-Series
4.1 Functions From software version SC.708.0 Edition 12/2014
210
4.1.5.4 Flip Chip Encoded Positions (After Calibration)
4
4
Fig. 4.1 - 9 Flip Chip Encoded Positions (After Calibration)
0°
Home sensor position
180°
Transfer position, segment 1
125°
Camera "free" position
96°
Discharge position, segment 1
90°
Home offset position
83°
Discharge position, segment 2
58°
Camera "free" position
User Manual SIPLACE CA-Series 4 SIPLACE Wafer System (SWS)
From software version SC.708.0 Edition 12/2014 4.1 Functions
211
4
Fig. 4.1 - 10 Initialization of flip rotation axis
(1) Mechanical Stop
(2) Home sensor
The home sensor is used to initialize the flip rotation axis. During the initialization the rotation axis
travels slowly until the home sensor triggers. Afterwards the first zero pulse is looked up in an area
of 0-30° of the rotation axis. Through that the zero position of the flip rotation axis is defined.
Reject bin
Segment no. 2
Reject bin
Segment no. 1
1. Mechanical Stop
2. Home sensor