00197498-03_UM_SiplaceCA-Serie_EN.pdf - 第196页
3 Technical Data User Manual SIPLACE CA-Series 3.15 PCB Warpage From software version SC.708.0 Edition 12/2014 EN -DRAFT 196 PCB warp age in the direction of transp ort + PC B thickness < 5.5 mm. Be nding up of board …
User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.15 PCB Warpage
195
3.15 PCB Warpage
3
3.15.0.1 PCB Warpage During Transportation
PCB warpage across the direction of travel max. 1 % of the PCB diagonal, but not exceeding 2 mm
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PLEASE NOTE
Vacuum Tooling for Thin Substrates
Vacuum tooling is not essential. However, it is needed for thin substrates, to ensure place-
ment accuracy and error-free handling.
Use the vacuum tooling option for thin substrates (less than 0.7 mm), to maintain the
prescribed PCB warpage.
Fixed clamped edge
Movable clamping device
Printed circuit board
Conveyor side
3 Technical Data User Manual SIPLACE CA-Series
3.15 PCB Warpage From software version SC.708.0 Edition 12/2014 EN -DRAFT
196
PCB warpage in the direction of transport + PCB thickness < 5.5 mm. Bending up of board edge
max. 2.5 mm.
3
3
Fixed clamped edge
Conveyor belt
PCB transport direction
Front board edge
Front board edge
Left conveyor belt
Right conveyor belt
PCB transport direction
User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.15 PCB Warpage
197
3.15.0.2 PCB Warpage During Placement
A warpage of 2 mm could lead to problems focusing on local fiducials and ink spots in the middle
of the PCB. The digital camera's focus is 2 mm. When all the tolerances are taken into account,
this value is reduced to 1.5 mm. Also note that the component height is reduced by the warpage.
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3
PCB warpage down, max. 0.5 mm
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Use magnetic pin supports to achieve this value.
Movable clamping device
Fixed clamped edge
Printed circuit board
Conveyor side
Printed circuit board
Magnetic pin
support
Movable clamping device
Fixed clamped edge
Conveyor side
0.5 mm