00197498-03_UM_SiplaceCA-Serie_EN.pdf - 第383页
User Manual SIPLACE CA-Series 6 Working with the Machine From software version SC.708.0 Edition 12/20 14 EN -DRAFT 6.10 Changing the Setup 383 6.10.2 Changing the Setup on the SWS Check whether the orient ation of the …
6 Working with the Machine User Manual SIPLACE CA-Series
6.10 Changing the Setup From software version SC.708.0 Edition 12/2014 EN -DRAFT
382
6.10 Changing the Setup
6.10.1 Changing the Setup on the Placement Machine
6.10.1.1 Printing Out Conversion Instructions Before Changing the Setup
Before a change of setup, print out the conversion instructions on the printer for the SIPLACE Pro
computer as described in the "SIPLACE Pro" manual or in the online help.
6.10.1.2 Important Points When Changing the Feeder Modules
Handle the feeder modules carefully when you insert them into or remove them from the
changeover table. Make sure that the X feeder modules do not bump against the centering
bar (see item 5 in fig. 6.7 - 3
, page 373) of the changeover table.
Vacuum the supporting surfaces of the feeder modules and clean the surface of the compo-
nent feeder table when necessary according to the instructions in the Preventive Mainte-
nance Manual.
Remove loose components using a brush or a vacuum cleaner with a suitable nozzle.
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CAUTION
Risk of injuries!
Fine metal splinters from components could injure hands.
Avoid removing components from the changeover table with your fingers.
User Manual SIPLACE CA-Series 6 Working with the Machine
From software version SC.708.0 Edition 12/2014 EN -DRAFT 6.10 Changing the Setup
383
6.10.2 Changing the Setup on the SWS
Check whether the orientation of the wafer locking bar matches the relevant wafer size (see
fig. 4.3 - 5
page 221).
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Adjust the support plate for the wafer magazine and insert the new magazine. check that the
magazine is occupied correctly.
Check the needle configuration of the ejector system (see section 6.4.5, page 358).
Check whether the flip unit has been fitted with the required tools and nozzles (see section
6.4.6, page 362).
Load or compile the required product (see software guide).
PLEASE NOTE
Configuring the SWS
When putting the SWS into operation, it is configured with the required wafer size and
thickness of the wafer frame.
Adapting the SWS to other sizes and thicknesses is described in the service manual.
6 Working with the Machine User Manual SIPLACE CA-Series
6.11 Avoiding Track Errors From software version SC.708.0 Edition 12/2014 EN -DRAFT
384
6.11 Avoiding Track Errors
6.11.1 General
Make sure that the areas around the feeder modules are clean and that there are no loose
components in the feeder area or under the feeder modules.
Refill in good time with components.
Splice the tapes early. This generally means that you are to prepare the splicing material
when there is still approximately 1.5 m of tape on the reel.
Handle the feeder modules carefully when you insert them into or remove them from the
changeover table as these are high-precision devices.
Lower the pickup window for X feeder modules, as this can easily be damaged when raised.
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Check that the pick-up position is set correctly for the components on the feeder modules.
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PLEASE NOTE
A raised pick-up window leads to noticeably impaired pick-up quality.