00197498-03_UM_SiplaceCA-Serie_EN.pdf - 第123页
User Manual SIPLACE CA-Series 3 Technical Data From software version SC.708.0 Edition 12/20 14 EN -DRAFT 3.1 Performance Data for the SIPLACE CA 123 3.1.2 T echnical Dat a - SWS 3 T echnical Data Flip Chip Die Attach Min…
3 Technical Data User Manual SIPLACE CA-Series
3.1 Performance Data for the SIPLACE CA From software version SC.708.0 Edition 12/2014 EN -DRAFT
122
3.1.1 Maximum Values
Pickup on SWS Pickup on X-
table
Flip Chip Die Attach SMD
Accuracy
*a
C&P20 M
CPP
TH
± 10 µm at 3σ
± 25 µm at 3σ
--
± 10 µm at 3σ
± 25µm at 3σ
--
± 20 µm at 3σ
± 25 µm at 3σ
± 22 µm at 3σ
*b
Placement performance
*c
4 SWS, without dipping 4 SWS SMD
C&P20 M
CPP
TH
42,000 die/h
42,000 die/h
--
28,000 die/h
26,000 die/h
--
See page 121
Die / component size
Flip Chip Die Attach SMD
C&P20 M
CPP
TH
0.5 x 0.5 mm
*d
*e
to 6 x 6 mm
0.5 x 0.5 mm
d e
to 27 x 27 mm
--
0.8 x 0.8 mm
d
to 6 x 6 mm
0.8 x 0.8 mm
d
to 27 x 27 mm
--
See page 151
See page 161
See page 164
Feeder module
types
Tape feeder module, waffle pack tray, stick magazine
feeders, bulk case, dip module, application-specific
OEM feeder modules, SIPLACE Wafer Feeder (SWS)
Supply capacity
(Component trolley
SIPLACE X)
160 tape feeder modules 8 mm X
Substrate size 50 mm x 50 mm to 535 mm x 850 mm
*f
Substrate thickness 0.3 mm to 4.5 mm
*)a 10µm at 3σ in placement process with the "Embedded Wafer Level Ballgrid Array" option (on request).
*)b With stationary camera, type 25
*)c The placement performance depends on several project-specific parameters. The ex-
pected throughput can be individually calculated on request.
*)d Smaller dies on request
*)e Dipping: depends on process
*)f 850 mm on request
User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.1 Performance Data for the SIPLACE CA
123
3.1.2 Technical Data - SWS
3
Technical Data Flip Chip Die Attach
Minimum die thickness (silicium) - without com-
ponent sensor
50 µm 50 µm
Minimum die thickness (silicium) - with compo-
nent sensor
100 µm 100 µm
Minimum bump size 50 µm n/a
Minimum bump grid 100 µm n/a
SIPLACE Wafer System SWS Horizontal system, automatic wafer change, MCM
SWS wafer size 4" to 12"
4" / 6" with adapter on request
Wafer frame 12"/8"
6" on request
4" with adapter
Hoop /grip ring thickness Max. 3.5 mm
Wafer magazine
*a
Up to 12"
Die Ejection System Programmable ejection speed (synchronous and asynchronous)
Option: Linear Dipping Unit LDU Individually programmable speed
Flux viscosity 3,000 to 100,000 cPs
Accuracy of flux height ± 5 µm
*)a Depending on the wafer magazine, you may need to mechanically adjust the base plate for the wafer magazines.
3 Technical Data User Manual SIPLACE CA-Series
3.1 Performance Data for the SIPLACE CA From software version SC.708.0 Edition 12/2014 EN -DRAFT
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3.1.3 Technical Data - SMT
3
Placement head types SIPLACE SpeedStar (C&P20 M)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
Number of gantries CA4: 4 gantries
Component range 0.4 x 0.2 mm² (01005), 0.6 x 0.3 mm² (0201)
to 85 x 85 mm² / 125 x 10 mm²,
Max. 200 x 125 mm² (with restrictions)
Component height C&P20 M
CPP
TH
4 mm
6 mm / 8.5 mm / 11.5 mm
25 mm (greater height on request)
Placement accuracy
(Standard-criteria for
SMD)
C&P20 M
CPP
CPP
TH
TH
± 20 µm (3σ)
± 41 µm (3σ)
± 34 µm (3σ)
± 26 µm (3σ)
± 22 µm (3σ)
Component camera, type 41
Component camera, type 30
Component camera, type 33
Component camera, type 33
Component camera, type 25
Placement accuracy
(Advanced criteria for
SWS)
C&P20 M
CPP
TH
± 10 µm (3σ)
± 41 µm (3σ)
± 26 µm (3σ)
Component camera, type 41
Component camera, type 30
Component camera, type 33
Angular accuracy C&P20 M
CPP
*a
CPP
*b
CPP
TH
TH
± 0.2° (3σ)
± 0.4° (3σ)
± 0.5° (3σ)
± 0.2° (3σ)
± 0.05° (3σ)
± 0.05° (3σ)
Component camera, type 41
Component camera, type 30
Component camera, type 30
Component camera, type 33
Component camera, type 33
Component camera, type 25
*)a Component dimensions between 6 mm x 6 mm and 27 mm x 27 mm.
*)b Component dimensions smaller than 6 mm x 6 mm.