YSP_Users_E.pdf - 第37页
Printing guide 1. Flow of printing condition setting E-1 2. Data and condition setting E-2 2.1 Material and setup information E-2 2.2 Alignment of fset setting E-4 2.3 Rolling E-5 2.4 Printing and production conditions E…
Chapter 8 Inspection and maintenance
1. Precautions 8-1
2. Inspection and maintenance 8-2
2.1 Daily inspection 8-2
2.2 Periodic inspection (Weekly/Monthly) 8-3
2.2.1 Parts to be replaced during periodic replacement 8-3
2.2.2 Recommended grease 8-3
2.2.3 List of periodic inspection checkpoints 8-4
2.2.4 Parts recommended for periodic replacement 8-6
2.3 Adjusting the conveyor belt tension 8-7
2.3.1 Board carry-in and carry-out conveyors 8-7
2.3.2 Board clamp unit (board clamp table) 8-9
2.4 Inspecting and cleaning the air/mist filters 8-11
3. List of lubrication locations 8-13
3.1 X-, Y-, and Z-axis 8-13
3.1.1 X1-axis and X2-axis 8-13
3.1.2 Y-axis 8-14
3.1.3 Z-axis 8-14
3.2 Printing head 8-15
3.2.1 SY-axis 8-15
3.2.2 SZ-axis 8-15
3.3 Conveyor unit 8-16
3.3.1 PU-axis 8-16
3.3.2 MS-axis 8-16
3.3.3 W-axis (Conveyor auto width adjustment) 8-17
3.4 Vision camera unit 8-18
3.4.1 CX-axis 8-18
Appendix
1. Specifications A-1
1.1 Air regulator unit A-1
1.1.1 Air supply A-1
1.2 Connection between machines A-2
1.2.1 PREVIOUS INTERFACE connector A-3
1.2.2 NEXT INTERFACE connector A-4
1.3 Power connection terminals A-5
2. Compatible masks A-6
2.1 Mask size and mask stopper pin position A-6
2.2 Mask frame dimensions and mask standard position A-7
3. Inverter (suction unit) A-8
4. Board support jig combinations A-9
Printing guide
1. Flow of printing condition setting E-1
2. Data and condition setting E-2
2.1 Material and setup information E-2
2.2 Alignment offset setting E-4
2.3 Rolling E-5
2.4 Printing and production conditions E-6
3. Details of each parameter item E-7
3.1 Board clamp E-7
3.1.1 Edge clamp pressure E-7
3.1.2 Backup jig E-8
3.2 Board and mask mark recognition (Mark position) E-8
3.3 Alignment offset E-8
3.4 Squeegee (Rolling) E-9
3.4.1 Squeegee speed E-9
3.4.2 Squeegee pressure E-9
3.4.3 Attack angle (degree (°)) E-9
3.5 Solder supply interval E-10
3.6 Detach pattern E-10
3.6.1 Board separation speed E-10
3.6.2 Board separation distance E-11
3.7 Cleaning E-11
3.7.1 Cleaning interval E-11
3.7.2 Cleaning repeat E-11
3.7.3 Cleaning speed E-11
4.
Causes of troubles predicted from symptoms (Appendix)
E-12
4.1 Positional deviation E-12
4.2 Blur E-12
4.3 Insufficient filling E-12
4.4 Solder spread, solder bridge E-13
4.5 Scraping trouble E-13
4.6 Solder enlargement E-13
4.7 Solder chipping, mask remaining E-13
Index
About Instruction
The instruction manual of this machine is written for those who operate
this machine.
Please read this manual carefully for correct operations and pay
special attention to safety precautions.
After reading through this manual, please use this manual as an
occasional reference and keep it within reach.
About this manual
Contents
1. About this manual i
1.1 Revision record i
1.2 Contents of each chapter ii
1.3 Page layout iii