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SIPLACE 80S/F/G User’s Manual 7 Vision Systems Edition 07/97 from S oftware Version SR.010.xx 7.1 Survey of the Vision S ystems of the SIPLAC E 80 S/F/G Machines Line engi neer 7 - 5 Fig. 7.1.3 Evaluation units for gantr…
7 Vision Systems SIPLACE 80S/F/G User’s Manual
7.1 Survey of the Vision Systems of the SIPLACE 80 S/F/G Machines Edition 07/97 from Software Version SR.010.xx
7 - 4 Line engineer
The range of components for optical centering and placement extends from 0402 to SO28 components,
that is, the component size varies between 1.0 mm x 0.5 mm and max. 14 mm x 18 mm with a component
thickness of between 0.3 mm and 4.5 mm.
The PCB vision system for the 80S, 80F and G machines centers boards from the smallest size of 50 mm x 50
mm up to 460 mm x 460 mm, and up to 508 mm x 460 mm (as option). The board thickness may vary here
within the range of 0.5 mm and 3 mm.
Two vision evaluation units (ICOS MVS systems), accommodated in the control unit of the machine (see Fig.
7.1.3), process and evaluate the signals of the camera systems (PCB and component vision systems) of each
placement head. From the setpoint deviations correction values are determined which, in turn, are used in the
recalculation of the placement positions and angle of rotation of the components which are to be mounted.
Fig. 7.1.2 Camera systems for PCB and component position recognition on the revolver placement heads
Component camera
PCB optical system
PCB
camera
Deflection mirror and
component optical system
SIPLACE 80S/F/G User’s Manual 7 Vision Systems
Edition 07/97 from Software Version SR.010.xx 7.1 Survey of the Vision Systems of the SIPLACE 80 S/F/G Machines
Line engineer 7 - 5
Fig. 7.1.3 Evaluation units for gantry 1 and gantry 2 of the SIPLACE 80S placement systems
7 Vision Systems SIPLACE 80S/F/G User’s Manual
7.1 Survey of the Vision Systems of the SIPLACE 80 S/F/G Machines Edition 07/97 from Software Version SR.010.xx
7 - 6 Line engineer
7.1.2 Vision Systems in the SIPLACE 80F Placement Machine
The single gantry system of the SIPLACE 80F machine (see Fig. 7.1.4) includes a revolver placement head
and an IC placement head. The revolver placement head is equipped with two camera systems: one for PCB
and the other for component position recognition (see Fig. 7.1.2). The camera systems (up to two) for compo-
nent position recognition for the IC placement head are attached to the machine base (see Fig. 7.1.5).
Fig. 7.1.4 Location of the revolver head and IC head on the SIPLACE 80F placement system
While the revolver placement head optically centers and mounts components up to a size of 14 mm x 18 mm,
the IC head covers the component range up to a size of 55 mm x 55 mm.
The camera system for PCB position recognition is fitted to the revolver placement head. As a standard fea-
ture it centers boards sized from a minimum of 50 mm x 50 mm up to 508 mm x 460 mm, and as an option up
to 610 mm x 460 mm. The board thickness may vary here within the range between 0.5 mm and 3 mm.
IC placement head
Revolver
head