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SIPLACE 80S/F/G User’s Manual 7 Vision Systems Edition 07/97 from S oftware Version SR.010.xx 7.1 Survey of the Vision S ystems of the SIPLAC E 80 S/F/G Machines Line engi neer 7 - 9 7.1.3 Vision System in the SIPLACE G …

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7 Vision Systems SIPLACE 80S/F/G User’s Manual
7.1 Survey of the Vision Systems of the SIPLACE 80 S/F/G Machines Edition 07/97 from Software Version SR.010.xx
7 - 8 Line engineer
Fig. 7.1.6 Evaluation unit for the SIPLACE 80F placement system
SIPLACE 80S/F/G User’s Manual 7 Vision Systems
Edition 07/97 from Software Version SR.010.xx 7.1 Survey of the Vision Systems of the SIPLACE 80 S/F/G Machines
Line engineer 7 - 9
7.1.3 Vision System in the SIPLACE G Adhesive Application Station
The single gantry system of the SIPLACE G adhesive application station features 3 adhesive application
heads.
Fig. 7.1.7 Location of the adhesive application heads in the SIPLACE G adhesive application station
The adhesive application stations 1 and 2 can still be moved individually relative to the main gantry axes in
each case in the y and x directions. This means that it is possible for adhesive spots to be placed simulta-
neously.
The third adhesive application station is permanently mounted on the main gantry and has the job of placing
either extremely large spots of adhesive with a large adhesive needle or extremely small spots with a small
needle.
Adhesive application head 1
Adhesive application head 2
Adhesive
application head 3
7 Vision Systems SIPLACE 80S/F/G User’s Manual
7.1 Survey of the Vision Systems of the SIPLACE 80 S/F/G Machines Edition 07/97 from Software Version SR.010.xx
7 - 10 Line engineer
Fig. 7.1.8 Location of the PCB camera in the SIPLACE G adhesive application station
Key to Fig. 7.1.8:
PCB camera on the underside of the gantry
Fig. 7.1.8 indicates the position of the PCB camera in the SIPLACE G machine.
The vision evaluation unit - accommodated in the control unit of the machine (see Fig. 7.1.9) - processes the
signals of the PCB camera system. From the setpoint deviations correction values are determined, which are
in turn used in the recalculation of the adhesive spot positions.
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