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SIPLACE 80S/F/G User’s Manual 11 Station Extensions Edition 07/97 from S oftware Version SR.010.xx 11.5 Flip Chip Vision M odule 11 - 23 11.5 Flip Chip Vision Mo dule 11.5.1 Overview The fli p chip visio n module is base…
11 Station Extensions SIPLACE 80S/F/G User’s Manual
11.4 Component Bar-Code Edition 07/97 from Software Version SR.010.xx
11 - 22
11.4.3.1 Flow diagram for operating sequence
Fig. 11.4.2 Flow diagram for component bar-code operating sequence
SIPLACE 80S/F/G User’s Manual 11 Station Extensions
Edition 07/97 from Software Version SR.010.xx 11.5 Flip Chip Vision Module
11 - 23
11.5 Flip Chip Vision Module
11.5.1 Overview
The flip chip vision module is based on the concept of the fine pitch vision system.
It differs from it in that the resolution is higher and the illumination has been modified. Two illumination levels
are available, for a flat and for a middle angle of incidence.
The package form editor has been extended to cover programming of the array-type lead structures and for
some irregular structures.
Fig. 11.5.1 Location of the flip-chip vision module
The module is described, including using it, in Section 7, ’Vision Systems’.
11 Station Extensions SIPLACE 80S/F/G User’s Manual
11.5 Flip Chip Vision Module Edition 07/97 from Software Version SR.010.xx
11 - 24
11.5.2 Safety Information concerning the Components Vision Systems
in the 80F Machine
DANGER
∆
!
∆
!
∆
!
You must not modify or tamper with the safety devices of the 80F machine or of the IC or flip chip module in
any way at all!
The optical radiation of the IC and flip chip sensors corresponds to laser class 1 provided the sensors are per-
manently installed in the machine (EN 60825-1 and IEC 825).
Fig. 11.5.2 Identification label for Laser class 1
LASER CLASS1