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SIPLACE 80S/F/G User’s Manual 0 Introduction Edition 07/97 from S oftware Version SR.010.xx 0.2 Technical Data 0 - 17 0.2.3 SIPLACE G 0.2.3.1 G Main Gantry 0.2. 3.2 Glui ng Unit G main ga ntry Drive D.C. servo m otors Pa…

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0 Introduction SIPLACE 80S/F/G User’s Manual
0.2 Technical Data Edition 07/97 from Software Version SR.010.xx
0 - 16
0.2.2.8 Wafflepack Changer
Wafflepack changer
Magazine size Max. 238 mm x 338 mm
Magazine height incl. component 15 mm (taller magazines will reduce the number of the trays
Holding capacity 28 trays for holding flatpack magazines
Number of component types Max. 200 for entire WPC
Change time (magazine / magazine)
≤
3 sec.
SIPLACE 80S/F/G User’s Manual 0 Introduction
Edition 07/97 from Software Version SR.010.xx 0.2 Technical Data
0 - 17
0.2.3 SIPLACE G
0.2.3.1 G Main Gantry
0.2.3.2 Gluing Unit
G main gantry
Drive D.C. servo motors
Path-measuring system Linear incremental scales
Resolution x / y axes 2.5
µ
m
Max. speed x axis 0.6 m/s
Max. speed y axis 0.6 m/s
Mini gantry
Drive D.C. servo motors
Path-measuring system Incremental shaft encoder
Resolution kx/ ky axis 17.5 µm
Gluing head
Placement force z axis < 6 N
Z axis stroke 16 mm
Glue types which can be used
Heraeus PD 922/PD944
Heraeus PD 86000 2SPA
Heraeus PD 911
Loctite 3609
Amicon D125 F3/D125 FDR
Please consult AUT 5 before using other glue types
Dispensing volume 0.02 mm³ to 2.0 mm³
Gluing sizes 20
Spacers 0.1 / 0.15 / 0.2 / 0.25 / 0.30 mm
Needle diameter 0.3 / 0.44 / 0.6 mm
Adhesive temperature regulator
Range of settings (
T
) 15.5°C to 40°C
Permissible ambient temperature (
T
U
)
15°C to 35°C
Control range
T
U
-8°C <
T
<
T
U
+ 12°C
0 Introduction SIPLACE 80S/F/G User’s Manual
0.2 Technical Data Edition 07/97 from Software Version SR.010.xx
0 - 18
0.2.3.3 Boards (G)
0.2.3.4 Interfaces
0.2.1.5 Interfaces 80S
Boards
Boards (PCB) transport system In-line transport with width adjustment
PCB format 50 mm x 50 mm to 460 mm x 460 mm with PCB buffer
Component-free guide edge of the board 3 mm
Min. PCB thickness 0.5 mm
Max. PCB thickness 4.5 mm
Max. PCB warpage
Upwards : 4.5 mm less PCB thickness
Downwards: 0.5 mm plus PCB thickness
PCB change time 2.5 sec.