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SIPLACE 80S/F/G User’s Manual 7 Vision Systems Edition 07/97 from S oftware Version SR.010.xx 7.6 Test Co mponent Line engi neer 7 - 73 The IC he ad of the 80 F machine picks up th e BGAs or fl ip chips fr om the flatpa …

7 Vision Systems SIPLACE 80S/F/G User’s Manual

7.6 Test Component Edition 07/97 from Software Version SR.010.xx

7 - 72 Line engineer

7.6.3.4 Option “Measure component”

NOTE

This option is only activated when a GF number has previously been entered.

Fig. 7.6.9

When this option is activated the following actions are initiated:

–

The video image is displayed on the screen.

–

The measurement command is initiated with the predefined parameters.

–

The MVS executes the component-specific measurement steps one after the other.

–

The measured values are superimposed on the video image.

With the Siplace 80F machine from software version 7.x onwards, in addition to conventional components with

leads it will also be possible to optically center BGAs (B

all Grid Arrays), and from software version 8.x flip

chips as well. The component body of the BGAs and flip chips consists of passivated silicon chips. These chip

bodies reflect strongly and are wavy. The connections of these components take the form of solder balls with

a diameter of at least 80

m. With ball grid arrays the connections are arranged in the form of a grid, which

means that they can be described in terms of rows and columns.

With flip chips the solder balls are located irregularly over the body of the component. For this reason the

coordinates of each lead must be determined individually.

Error

State

Action

Measure component

Single functions

Cluster:

SI80 V 10.x

Vision system

Version: 2133

Setup:

Test component

Enter GF number

Pickup component

Display component

Measure component

Test component

Edit GF data

Change measure mode

Refill

Display errors

Test output

SIPLACE 80S/F/G User’s Manual 7 Vision Systems

Edition 07/97 from Software Version SR.010.xx 7.6 Test Component

Line engineer 7 - 73

The IC head of the 80F machine picks up the BGAs or flip chips from the flatpack magazines. However the

evaluation procedures which have been used so far for conventional components are no longer adequate for

optical centering of BGAs and flip chips. For this reason new evaluation procedures and new lighting methods

at the IC sensor and/or FC sensor have been developed to make it possible to center optically this new gener-

ation of components. BGAs and flip chips which cannot be optically centered will be returned to the flatpack

magazine by the IC head for further analysis.

Fig. 7.6.10

Optical gauging of conventional components with lead connections in the 80S and 80F placement

machine

The crosshairs show the center of gravity of the component. The component outlines are emphasized by

color.

The measured values represent the geometric component parameters such as

–

Pin deviation

The value for the lead deviation is output if you have selected the "Lead-driven" measurement mode.

–

Spacing

The value is output if the "Corner-driven" measurement mode is active as the last measurement step.

–

Number of pins

–

x / y offset

–

Orthogonality

Measure component

GF No. = 5

X offset = ... Y offset = ...

Phi = ...

Orthogon = ...

No. of pins = ...

Quality fact. = ...

Length[mm] = ...

Width[mm] = ...

Spacing[mm] =

RET: Measure component

P.dev.[mm] =

7 Vision Systems SIPLACE 80S/F/G User’s Manual

7.6 Test Component Edition 07/97 from Software Version SR.010.xx

7 - 74 Line engineer

–

Dimensions of the component

–

Angle of rotation and

–

Measurement quality factor.

With “ESC” you may quit this option, the video image disappears. The menu “Test component” reappears on

the screen.

Color overlays of the individual measurement steps in cycle mode

1. Size-Driven Mode

See Section 7.6.5.2 from page 7 - 95 for a definition of the measuring methods.

This measurement mode can be recognized by rotating windows around the edges of the component

Procedure

I. Within the search window profiles are shown in x and y directions. By means of the gradients derived from

these and a geometric filter the approximate position of the component is determined.

II. Windows rotate around the edges of the component. For each window the profile and the gradients are

determined. The sum of the gradients is a measure of the agreement of the window angle with the position

of the component.

If the sum of the gradients reaches a maximum, the angular position of the component has been deter-

mined.

III. Under the angle determined in II the first step (I) is repeated. Now the position of the component can be

determined more exactly on the x and y axes.

Rectangles:

green: x and y location tolerances

orange: Component dimensions and tolerances sent from the station

blue: Search window for position recognition

Comments

1. The position in which the component was found must lie within the green rectangle or the compo-

nent is not mounted.

Applies to all measurement steps!

2. The component must be located inside the orange window or the measurement results should be

questioned.

3. The search windows should have the same alignment as the component and be larger than it.

Lines:

red: Component edges found

Comments:

The red lines are often covered by others and it may not be possible to recognize them.