SG_FSE_SiplaceHF_HF3_00193901-05_eng.pdf - 第203页
1 - 3 S tudent Guide SIPLACE HF/HF3 Edition 09/2005 6 Colle ct &Place-Head / DLM2 3 6.1.1.1 T echnical Dat a: 6 Segment / 12 Segment C&P heads. 6.1.1.2 Camera modularity at the 6segmen t C&P head for example.…
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Student Guide SIPLACE HF/HF3
6 Collect &Place-Head / DLM2 Edition 09/2005
2
6.1.1 Technical Data 6/12 DLM2
Note Head Modularity
The adjustment of the axes dynamic after exchange the head will be adjust automatically from the
axes data base at the configuration setting.
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Student Guide SIPLACE HF/HF3
Edition 09/2005 6 Collect &Place-Head / DLM2
3
6.1.1.1 Technical Data: 6 Segment / 12 Segment C&P heads.
6.1.1.2 Camera modularity at the 6segment C&P head for example.
Description 12 segment DLM 2 6 segment DLM 2
Component size
1mm x 0,5mm (0402)/0,5mm x
0,25mm (0201) up to
18,7 mm x 18,7 mm
1,5mm x 0,75 mm (0603) up to
32 mm x 32 mm
Component height 6,0 mm 8,5 mm
Component weight 2,0 g 5,0 g
Placement Accuracy
+/- 60µm at 4 (Sigma) +/- 60µm at 4 (Sigma)
Angle Accuracy
+/- 0,7° at 4 (Sigma) +/- 0,3° at 4 (Sigma)
Placement force 2,4 - 5,0 N 2,4 - 5,0 N
Nozzle types
901, 904, 905; 911-919; 920-
925; 931-937
901, 904, 905; 911-919; 920-925;
931-937 817, 820, 821
Nozzle changer
set up for each magazine or set
up for each garage set up for each garage
Table 6.1 - 1 Technical data 6 / 12 C&P heads
Description 6 segment DLM 2 6 segment DLM 2with DCA
Component size
1,5mm x 0,75 mm (0603) up to
32 mm x 32 mm
0,5mm x 0,25 mm (0201) up to
15 mm x 15 mm
Component dimension: FlipChip /
Bare Die --
1mm x 1 mm up to
15 mm x 15 mm
Component height: FlipChip / Bare Die
0,15 mm up to 1 mm
Component height
8,5 mm
8,5 mm
Component weight 5,0 g 5,0 g
Placement accuracy
+/- 60µm at 4 (Sigma) +/- 55µm at 4 (Sigma)
Angle accuracy
+/- 0,4° at 4 (Sigma) +/- 0,4° at 4 (Sigma)
Placement force 2,4 - 5,0 N 2,4 - 5,0 N
Nozzle types
901, 904, 905; 911-919; 920-
925; 931-937 817, 820, 821
All 9xx nozzles & FlipChip/Bare Die
951, 952, 953, 954, 955, 956
Nozzlechanger
set up for each garage
only 9xx magazine.
set up for each garage
Table 6.1 - 2 Technical data Component camras
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Student Guide SIPLACE HF/HF3
6 Collect &Place-Head / DLM2 Edition 09/2005
4
6.1.2 Steps when picking up and placing components
– A PCB moves into the placement area of the PCB conveyor.
– After the fiducial measurement with both gantries for each placement area (with SW505), the
C&P head picks up components from the feeder moduls.
– The components are measured below the component camera and turned in the Dp station into
the correct angle position.
– In the star station 1 the component will be place.
6.1.3 Position and function of the individual star stations
Fig. 6.1 - 2 Overview of the functions of star stations 1 - 12 I-XII segment numbers
I-XIISegment numbering
Star station 1: pick up, place and reject component 6
Star station 2: no function 6
Star station 3: no function (at HF/HF3 machine) 6
Star station 4, 5 and 6: no function 6
Star station 7: optically center component 6
Star station 8: no function 6
Star station 9: rotate component 6
Star station 10: position for removing and inserting sleeves 6
Star stations 11 and 12: no function (optionally Component sensor between star station 11 & 12)6
optionally:
Component sensor