00194614-08 Trainingsdoku. SG X-Serie_X4i SW70x (AL2)_EN.pdf - 第292页

Collect, Pick and Place Head (CPP) Placement Modes Pickup and Placement Cycle for CPP Student Guide SIPLACE X-Serie and X4I SW70x (AL2) 292 Placement Modes 8.4.2 Placement Modes The CPP head functions according to the Co…

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Collect, Pick and Place Head (CPP)
Pickup and Placement Cycle for CPP Measuring Z Axis Position for Component Recognition by the Component Sensor
291 Student Guide SIPLACE X-Serie and X4I SW70x (AL2)
Measuring Z Axis Position for Comp onent Rec ognition by the C omponent Sensor
8.3.6 Measuring Z Axis Position for Component Recognition by the Component Sensor
While the Z axis moves downwards, the nozzle interrupts the laser beam of the component sensor. The
axis position is saved and later used for the calculation of the component height and component
presence. At the upwards movement of the Z axis, the laser beam is no longer interrupted and the axis
position is saved again. The component presence can be determined during placement by the
programmed component height (SIPLACE Pro) and the nozzle length, calculated during the height
reference run by the Z axis position counter.
Pickup and P lacement Cycl e for CPP
8.4 Pickup and Placement Cycle for CPP
Working Position on Placement Head
8.4.1 Working Position on Placement Head
Nozzle length reference values for component
recognition with component sensor
Legend
1. Component sensor
2. Nozzle
3. IR receiver
4. IR transmitter
During the height reference run, the component sensor
measures the Z axis position for each segment, to detect
the presence/absence of components in the pickup and
placement position.
Working Position on Placement Head
Legend
1. Optical centering (component camera)
2. Vacuum measurement holding circuit
3. Vacuum measurement placement circuit
4. Pickup/placement station and reject position
5. Position of component sensor
6. Direction of processing in C&P mode
Collect, Pick and Place Head (CPP)
Placement Modes Pickup and Placement Cycle for CPP
Student Guide SIPLACE X-Serie and X4I SW70x (AL2) 292
Placement Modes
8.4.2 Placement Modes
The CPP head functions according to the Collect&Place principle, like the C&P12 head, whereby the
additional operating modes Pick&Place and mixed mode help to extend the component spectrum.
The placement mode is, on the one hand, dependent on the configured camera and, on the other hand,
on the component dimensions and their tolerances in SIPLACE Pro.
The respective placement mode is determined by the Optimizer in SIPLACE Pro and can not be
influenced.
Overview of the placement modes
1. Collect & Place Mode
Component Range: 01005-27x27mm, 8,5mm height
Speed: 20.000 to 24.000 cph
Accuracy: +/- 55 µm @ 4 s; 0,3° @ 4s
The Collect-and-Place mode is the same mode for the C&P6/12 and C&P20A placement heads.
Components are picked up (the quantity depends on the number of segments), optically centered with
the component camera and then placed.
1. Mixed Mode
Component Range: 01005-32x32mm, 11,5 mm height
Mixed mode differentiates between the following two cases:
▪ The components are small enough to be rotated by the head.
▪ The components are too large. Just 2 or 3 components are picked up, centered by the stationary
camera and then placed.
1. Pick & Place Mode
Component Range: 01005-50x40mm, 11,5mm height
Speed: up to 1.500 cph
Accuracy: +/- 45 µm @ 4 s; 0,1° @ 4s
P&P mode: The Pick-and-Place mode is the mode used for IC and TwinHead. It is therefore also used
for the CPP head, which picks up components with either one or more segments, according to the
component size. Due to their size, it is not possible to rotate these components with the head and they
need to be optically centered via the stationary camera and then placed.
Collect, Pick and Place Head (CPP)
Pickup and Placement Cycle for CPP Placement Modes
293 Student Guide SIPLACE X-Serie and X4I SW70x (AL2)
Example
1. Collect and Place mode for small components only.
2. Collect and Place mode (with skipped segments) for medium components.
3. Mixed mode – collect and place for small components, pick and place for high components.
4. Mixed mode – collect and place for small components and pick and place for 1 large component.
The placement mode is dependent on the configured component camera and the component size with
their tolerance in SIPLACE Pro. It is automatically selected by the optimization software.
Collect&Place Mode
8.4.2.1 Collect&Place Mode
The Collect and Place Mode is the same mode as used by the existing C&P6/12 and C&P20 heads.
According to the number of available segments we pick up the component, center them and then place
them.
1. For the standard Collect and Place Mode, the max. component size is dependent on the camera
configuration (SST.29 & 38).
2. Components with a size up to 32 x 32 mm ( include the tolerance in SIPLACE Pro) can be picked up
and turned by the head. But they have to be centered with a stationary camera.