2OM-1075-002.pdf - 第31页
28 . Specifications When a program change is made, the P .C.B. transfer conveyor width of Automatic and the P .C.B. support pin’s up/down movement are automatically set Setup Function up. Minimum Unit of Movement P .C.B.…
26. P.E.C. View Approx. 16 × 12 mm
Recognition Ref.: Each head (Heads #1 and #2) is equipped
with a camera.
Window Size 1.0 × 1.0 to 5.0 × 5.0 mm
Photoimage Front Lighting System
(Recognition of Fiducial Mark by Front Lighting)
("Normal" or "Reverse" can be selected for each
mark.)
27. Fiducial Marks
Size: 0.5 to 3.0 mm or less
Others
Size: 1.0 to 2.0 mm or less
Others
Size: 0.5 to 2.0 mm or less
Material
• Copper Leaf
(Au and Ni plating possible but mirror surface cannot be used.)
• Solder Plating
(Consult our marketing department or sales agency for details.)
• Solder Leveler
(Consult our marketing department or sales agency for details.)
Notes: (a) A through hole or a pad mark should have only one land which
is directed in increments of 45°.
Consult our marketing department or sales agency for de-
tails.
(b) A fiducial mark should make ample contrast with the surround-
ings.
(c) A test may be required when the fiducial mark cannot be rec-
ognized because of the extreme warpage of the P.C.B.
(d) Anything resembling a pattern similar to a fiducial mark should
not exist in the designated window. If one exists, it may cause
false recognition.
The shape of P.C.B. (a cutout, a punched hole), the external
elements (light reflected from a structure, light emitted from
an external device, etc.) may sometimes interfere with rec-
ognition. Consult our marketing department or sales agency
for details.
(e) Consult our marketing department or sales agency for the
detailed information on the fiducial marks.
2. Specifications
Shape
Fiducial Marks
Through
Holes
Pad Mark
0206-003 1-13 AHB01ESPP
28. Specifications When a program change is made, the P.C.B. transfer conveyor width
of Automatic and the P.C.B. support pin’s up/down movement are automatically set
Setup Function up.
Minimum Unit of Movement
P.C.B. Transfer Conveyor Width : 0.1 mm
(Resolution: 0.0025 mm/pulse)
P.C.B. Support Pin Up/Down : 0.005 mm
(Resolution: 0.005 mm/pulse)
29. Teaching of Applicable Component Shapes
Component
Library Data
2. Specifications
Component Shape Applicable Components
Leadless Cylindrical
Components
Square
Deform
Leaded IC
Connectors
Others
Area Array BGA and LGA Components
Size of Applicable Components
Small View (mm) Large View (mm)
Outer Dimensions 1.0 × 0.5 2.0 × 1.2
to 18 × 18 to 55 × 55
(Max. 100 × 26)
See Note a below.
Minimum Lead Pitch 0.3 0.4
Minimum Lead Width 0.1 0.18
Minimum Ball Diameter 0.2 0.4
Minimum Ball Pitch 0.3 0.55
(Note: The component
thickness should
be 5 or less.)
Cylindrical Components
Resistors, Capacitors, Di-
odes, etc.
Square Components
Resistors, Capacitors, etc.
Deformed Components
Aluminum Electrolytic Capaci-
tors, Tantalum Capacitors,
Variable Resistors, etc.
ICs
SOP, QFP, SOJ, and PLCC,
etc.
Connectors
Leaded components other than
those described above
Mini-Mold Transistors, Coils,
etc.
0206-003 1-14 AHB01ESPP
Registered Number of Test Library Data
Up to 100 pieces
Ref.: The taught component library data can be saved in the network
terminal (option).
Notes: (a) The above number of registered library data is based on the
case where the connectors are used.
(b) The data for the BGA/CSP components exceeding "18 ×
18 mm" is created semi-automatically. (Manual Input of
Each Parameter)
(c) Automatic teaching operation may not be performed,
depending on the types (shapes) of components and
leads. In this case, it is required to manually enter or
correct the parameters.
• The molded part of a component is formed round or al-
most looks round.
• The molded part is formed by a complex polygon.
(Components (shapes) equivalent to "Deform (Complex)")
• The shape of the leads or the electrodes is not rectangu-
lar.
• Prominently poor contrast in the leads or the electrodes.
• Components having protruding portions in the mold at both
ends of the arrayed leads.
• Components having several types of leads or whose leads
are arrayed in complexity.
• Area array components whose balls cannot be grouped
(d) It is impossible to automatically teach the data for the vacuum
nozzles being used for component picks, the vacuum
nozzles not used for component picks, or the portion where
the image of a component is laid over the hole of the diffu-
sion plate.
It is required to manually correct the parameters that could
not be taught automatically.
(e) When a component stays completely inside the silhouette
of the vacuum nozzle (viewed through the back lighting),
the automatic teaching operation cannot be performed.
The automatic teaching operation cannot be performed
either, depending on the combination of a special vacuum
nozzle type and the component to be taught.
30. Power Supply 200±20 V AC, 3-Phase, 50/60 Hz
Connected to the power supply unit (3-phase 4-wire system)
(One of the four wires is used as a ground wire.)
31.Apparent Power Approx. 5 kVA
2. Specifications
0206-003 1-15 AHB01ESPP