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User Manual SIPLACE CA 3 Technical Data Edition 08/2011 EN 3.1 SIPLACE CA Performance Data 119 3 T echnical Dat a 3.1 SIPLACE CA Performance Dat a Placement head-types – 20 segment Collect & Place CA head (C&P20C…
2 Operational Safety User Manual SIPLACE CA
2.13 ETUC Guidelines Edition 08/2011 EN
118
Always place the modules on a conductive surface (table with an ESD coating, conductive ESD
foam, ESD bag or container).
Do not move the assemblies near to data view devices, screens or television units. Keep a mini-
mum distance of > 10 cm to screens.
2.13.4 Measurements and Modifications to ESD Modules
Do not take measurements on the modules unless the following conditions are fulfilled:
– the measuring device is earthed (e.g. via PE conductors) or
– you discharge the measuring head just before taking measurements with a potential-free
measuring device (e.g. by touching an unpainted metal part of the controller casing).
Always use an earthed soldering iron if you carry out any soldering work.
2.13.5 Dispatching ESD Modules
Always store modules and components in conductive packaging (e.g. metallized plastic bags
or metal sleeves) and dispatch them in conductive packaging.
If the packaging is not conductive, place the modules in a conductive envelope before pack-
aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex-
ample. NEVER use plastic bags or film. 2
If the module has integral batteries, ensure that the conductive packaging does not touch or
short-circuit the battery terminals and, if necessary, first cover the terminals with insulating
tape or material.
User Manual SIPLACE CA 3 Technical Data
Edition 08/2011 EN 3.1 SIPLACE CA Performance Data
119
3 Technical Data
3.1 SIPLACE CA Performance Data
Placement head-types
– 20 segment Collect&Place CA head (C&P20CA) (fig. 3.8 - 3
, page 185)
– 12 segment Collect&Place CA head (C&P12CA) (fig. 3.8 - 6
, page 194)
– 6 segment Collect&Place CA head (C&P6CA) (fig. 3.8 - 9
, page 199)
– SIPLACE TwinHead (TH) (fig. 3.8 - 12
, page 204)
NOTE 3
The C&PCA heads differ from conventional C&P heads primarily in their enhanced accuracy,
which is accomplished by a selection process.
NOTE 3
The SWS cannot be usedin processing areas with only one gantry or in combination with the
twinhead or the high-force head in the same placement area.
3 Technical Data User Manual SIPLACE CA
3.1 SIPLACE CA Performance Data Edition 08/2011 EN
120
NOTE 3
The following table lists the benchmark values (as defined in "Scope of Service and Delivery
SIPLACE CA") for SMT placement in each placement area. As the benchmark test for the Twin-
Head and the C&P heads uses different components, the benchmark values for the TwinHead
and C&P heads must be specified separately. However, the joint component spectrum can still
be processed by both the TwinHead and the Collect&Place heads in the same production envi-
ronment.
Die placement depends on several process-specific parameters. The expected throughput can be
individually calculated on request.
The benchmark values for one SWS and a die size of 1x1 mm are:
In “Flip Chip” mode: 9,000 dies / h without flux dipping 3
In “Flip Chip” mode: 6,000 dies / h with flux dipping 3
In “Die Attach” mode (on request): 6.000 dies / h 3
Placement heads in placement area (PA) Placement rate [comp./h]
SMD Application
C&P20CA and C&P20CA 40,000 cph ± 3 %
C&P12 and C&P12 26,400 cph ± 3 %
C&P12 and C&P6 20,300 cph ± 3 %
C&P6 and C&P12 20,300 cph ± 3 %
C&P6 and C&P6 18,300 cph ± 3 %
TH and TH 5,800 cph ± 3 %
C&P12 and TH C&P12: 14,000 cph ± 3 %
TH: 3,300 cph ± 3 %
C&P6 and TH C&P6: 9,800 cph ± 3 %
TH: 3,300 cph ± 3 %
C&P20CA 20,000 cph ± 3 %
C&P12 14,000 cph ± 3 %
C&P6 9,800 cph ± 3 %
TH 3,700 cph ± 3 %