00195941-03-UM SiplaceCA-EN.pdf - 第173页
User Manual SIPLACE CA 3 Technical Data Edition 08/2011 EN 3.7 SIPLACE Wafer System (SWS) 173 NOTE 3 In this first version there is no automatic ejection tool changer available. For this re ason the SWS can only process …
3 Technical Data User Manual SIPLACE CA
3.7 SIPLACE Wafer System (SWS) Edition 08/2011 EN
172
3.7.6.6 Ejection Tool
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Fig. 3.7 - 23 Ejection tool
(1) Vacuum cap
(2) Ejection needle
The die ejector is needed to separate the die from the wafer foil. It consists of a base unit and the
ejection tool.
The ejection tool is mounted to the base unit and consists of the interface, the needle system and
a vacuum cap.
The wafer foil is sucked up to the vacuum cap by a vacuum, the needle system travels upwards
and removes the die from the wafer foil. Now the die can be picked up by the nozzle of the flip unit.
The ejector tool needs to be adjusted to the size of the die and can therefore be exchanged to suit
requirements. It is fixed to the base unit by means of a bayonet lock.
The ejector tool can be equipped with 2 different needle types:
– Non-piercing needles
These cause the wafer foil to arch and therefore release the die. The wafer foil is not pierced
in this case, so that the components are not touched by the needles.
– Piercing needles
These pierce the wafer foil and lift the die directly off the foil.
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User Manual SIPLACE CA 3 Technical Data
Edition 08/2011 EN 3.7 SIPLACE Wafer System (SWS)
173
NOTE 3
In this first version there is no automatic ejection tool changer available. For this reason the SWS
can only process dies without interruption that can be ejected with the same ejection tool.
3.7.6.7 Wafer Changer System
The wafer changer system consists of the magazine lift and the wafer changer with gripper.
The wafer changer system is needed to ensure a fully automatic production with the SWS. The
operator is only needed for refilling the magazine lift with new wafer cassettes.
The wafers are provided in a wafer magazine. The wafer magazine is placed by the user into the
wafer magazine lift. The magazine lift lifts the wafer magazine into the appropriate height so that
the corresponding wafer is in handover position. In this position the wafer changer can take the
wafer out of the magazine and push it back in after the wafer has been processed.
The wafer changer consists primarily of the gripper unit and the guidance rails. The gripper unit
takes up the wafer and moves it to the position currently required.
3 Technical Data User Manual SIPLACE CA
3.7 SIPLACE Wafer System (SWS) Edition 08/2011 EN
174
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Fig. 3.7 - 24 Wafer changer system
(1) Wafer changer with gripper
(2) Magazine lift
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